Assignee
NANYA TECHNOLOGY CORP
TW·2,132 granted patents·1,048 pending applications·5,639 citations·filing 1996–2025
Top patents by PatentIndex Score
3,180 records- 0199US11557572B2Semiconductor device with stacked dies and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Jan 17, 2023·12 cites·11 claims
- 0299US11315903B2Semiconductor device with connecting structure and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Apr 26, 2022·8 cites·1 claims
- 0398US11374009B2Integrated circuit device and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2020·Granted Jun 28, 2022·4 cites·6 claims
- 0498US11315869B1Semiconductor device with decoupling unit and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Apr 26, 2022·6 cites·20 claims
- 0598US11189622B1Semiconductor device with graphene layer and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Nov 30, 2021·10 cites·18 claims
- 0698US11127632B1Semiconductor device with conductive protrusions and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Sep 21, 2021·6 cites·18 claims
- 0798US11107775B1Semiconductor device with electrically floating contacts between signal-transmitting contactsNANYA TECHNOLOGY CORP·Filed 2020·Granted Aug 31, 2021·6 cites·17 claims
- 0898US11063012B1Semiconductor structure having buffer under bump pad and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2020·Granted Jul 13, 2021·5 cites·20 claims
- 0997US12354965B2Semiconductor device with redistribution structure and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2022·Granted Jul 8, 2025·3 cites·20 claims
- 1097US12183643B2Implanting system for fabricating semiconductor device structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Dec 31, 2024·4 cites·12 claims
- 1197US12100634B2Semiconductor device with re-fill layerNANYA TECHNOLOGY CORP·Filed 2021·Granted Sep 24, 2024·4 cites·17 claims
- 1297US11917813B2Memory array with contact enhancement cap and method for preparing the memory arrayNANYA TECHNOLOGY CORP·Filed 2021·Granted Feb 27, 2024·2 cites·6 claims
- 1397US11830865B2Semiconductor device with redistribution structure and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Nov 28, 2023·3 cites·11 claims
- 1497US11832440B2Method of forming memory deviceNANYA TECHNOLOGY CORP·Filed 2022·Granted Nov 28, 2023·3 cites·7 claims
- 1597US11792972B2Method for preparing memory array with contact enhancement capNANYA TECHNOLOGY CORP·Filed 2021·Granted Oct 17, 2023·2 cites·9 claims
- 1697US11749730B2Semiconductor device with contact structure and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Sep 5, 2023·4 cites·9 claims
- 1797US11742286B2Semiconductor device with interconnect part and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Aug 29, 2023·4 cites·10 claims
- 1897US11587632B1Semiconductor device structure having fuse elementsNANYA TECHNOLOGY CORP·Filed 2021·Granted Feb 21, 2023·8 cites·10 claims
- 1997US11456242B2Semiconductor device with stress-relieving structures and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 2097US11417744B2Semiconductor structure having buried gate electrode with protruding member and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Aug 16, 2022·6 cites·13 claims
- 2197US11355464B2Semiconductor device structure with bottle-shaped through silicon via and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Jun 7, 2022·4 cites·20 claims
- 2297US11315928B2Semiconductor structure with buried power line and buried signal line and method for manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Apr 26, 2022·4 cites·12 claims
- 2397US11315930B2Semiconductor structure and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Apr 26, 2022·7 cites·11 claims
- 2497US11315904B2Semiconductor assembly and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Apr 26, 2022·4 cites·20 claims
- 2597US11309263B2Semiconductor device structure with air gap structure and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Apr 19, 2022·4 cites·20 claims
- 2697US11127628B1Semiconductor device with connecting structure having a step-shaped conductive feature and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Sep 21, 2021·4 cites·18 claims
- 2797US11114441B1Semiconductor memory deviceNANYA TECHNOLOGY CORP·Filed 2020·Granted Sep 7, 2021·4 cites·10 claims
- 2897US11114335B1Semiconductor device structure with air gap structure and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Sep 7, 2021·11 cites·20 claims
- 2997US11101273B1Semiconductor structure having word line disposed over portion of an oxide-free dielectric material in the non-active regionNANYA TECHNOLOGY CORP·Filed 2020·Granted Aug 24, 2021·8 cites·16 claims
- 3097US11094662B1Semiconductor assembly and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Aug 17, 2021·5 cites·7 claims
- 3196US12131908B2Semiconductor structure with air gap in pattern-dense region and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2023·Granted Oct 29, 2024·2 cites·8 claims
- 3296US11935834B2Method for preparing semiconductor device with contact structureNANYA TECHNOLOGY CORP·Filed 2023·Granted Mar 19, 2024·2 cites·7 claims
- 3396US11785757B2Method for preparing memory array with contact enhancement sidewall spacersNANYA TECHNOLOGY CORP·Filed 2021·Granted Oct 10, 2023·2 cites·7 claims
- 3496US11756641B2Method for determining status of a fuse elementNANYA TECHNOLOGY CORP·Filed 2022·Granted Sep 12, 2023·3 cites·10 claims
- 3596US11749364B2Semiconductor circuit and semiconductor device for determining status of a fuse elementNANYA TECHNOLOGY CORP·Filed 2022·Granted Sep 5, 2023·3 cites·11 claims
- 3696US11742209B2Method for preparing semiconductor device with air gap in pattern-dense regionNANYA TECHNOLOGY CORP·Filed 2021·Granted Aug 29, 2023·3 cites·4 claims
- 3796US11647622B2Semiconductor structure having fin structures and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted May 9, 2023·3 cites·14 claims
- 3896US11605606B2Semiconductor device with spacer over bonding padNANYA TECHNOLOGY CORP·Filed 2022·Granted Mar 14, 2023·3 cites·11 claims
- 3996US11380758B2Semiconductor device with air gap and boron nitride cap and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Jul 5, 2022·4 cites·10 claims
- 4096US11355435B2Semiconductor device with air gapsNANYA TECHNOLOGY CORP·Filed 2020·Granted Jun 7, 2022·4 cites·15 claims
- 4196US11309186B2Semiconductor device with air gap in pattern-dense region and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Apr 19, 2022·4 cites·12 claims
- 4296US11227926B2Semiconductor device and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Jan 18, 2022·4 cites·16 claims
- 4396US10559568B1Method for preparing semiconductor capacitor structureNANYA TECHNOLOGY CORP·Filed 2018·Granted Feb 11, 2020·13 cites·11 claims
- 4496US10181472B1Memory cell with vertical transistorNANYA TECHNOLOGY CORP·Filed 2017·Granted Jan 15, 2019·18 cites·14 claims
- 4596US2026096091A1Memory device having ultra-lightly doped region and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 4695US12342571B2Method for manufacturing semiconductor device with passing gateNANYA TECHNOLOGY CORP·Filed 2022·Granted Jun 24, 2025·2 cites·20 claims
- 4795US12278190B2Manufacturing method of semiconductor package structure having interconnections between diesNANYA TECHNOLOGY CORP·Filed 2023·Granted Apr 15, 2025·2 cites·12 claims
- 4895US12272651B2Semiconductor package structure having interconnections between dies and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2022·Granted Apr 8, 2025·2 cites·18 claims
- 4995US12068203B2Method for manufacturing semiconductor device structureNANYA TECHNOLOGY CORP·Filed 2021·Granted Aug 20, 2024·2 cites·2 claims
- 5095US12062656B2Semiconductor device structureNANYA TECHNOLOGY CORP·Filed 2021·Granted Aug 13, 2024·2 cites·12 claims
Showing the top 50 of 3,180 patent records by PatentIndex Score.
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