Assignee
OHTA HIROYUKI
JP·7 granted patents·2 pending applications·20 citations·filing 2005–2012
Top patents by PatentIndex Score
9 records- 0183US8258576B2Method of manufacturing a semiconductor device including epitaxially growing semiconductor epitaxial layers on a surface of semiconductor substrateOHTA HIROYUKI·Filed 2009·Granted Sep 4, 2012·9 cites·7 claims
- 0278US9709377B2Strain sensor chip mounting structure, strain sensor chip and method of manufacturing a strain sensor chip mounting structureOHTA HIROYUKI·Filed 2012·Granted Jul 18, 2017·4 cites·19 claims
- 0375US8288757B2Semiconductor device and manufacturing method thereofOHTA HIROYUKI·Filed 2010·Granted Oct 16, 2012·4 cites·19 claims
- 0460US8481383B2Method of forming semiconductor device having buffer layer between sidewall insulating film and semiconductor substrateOHTA HIROYUKI·Filed 2011·Granted Jul 9, 2013·1 cites·4 claims
- 0555US8146443B2Rotating body dynamic quantity measuring device and systemOHTA HIROYUKI·Filed 2010·Granted Apr 3, 2012·1 cites·1 claims
- 0654US8186228B2Strain measuring deviceOHTA HIROYUKI·Filed 2011·Granted May 29, 2012·1 cites·5 claims
- 0748US8324040B2Semiconductor device and method for fabricating the sameOHTA HIROYUKI·Filed 2010·Granted Dec 4, 2012·0 cites·16 claims
- 0840US2006043508A1Apparatus for measuring a mechanical quantityOHTA HIROYUKI·Filed 2005·Application pending·0 cites
- 0940US2006179958A1Rotating body dynamic quantity measuring device and systemOHTA HIROYUKI·Filed 2006·Application pending·0 cites
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