Assignee
OKINS ELECTRONICS CO LTD
KR·8 granted patents·7 pending applications·8 citations·filing 2008–2025
Top patents by PatentIndex Score
15 records- 0185US12100607B2Magnetic colletOKINS ELECTRONICS CO LTD·Filed 2023·Granted Sep 24, 2024·1 cites·3 claims
- 0276US8378708B2Inspecting method using an electro optical detectorOKINS ELECTRONICS CO LTD·Filed 2008·Granted Feb 19, 2013·5 cites·24 claims
- 0373US12211722B2Magnetic colletOKINS ELECTRONICS CO LTD·Filed 2024·Granted Jan 28, 2025·0 cites·1 claims
- 0473US2025362339A1Semiconductor test apparatusOKINS ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0565US12222367B2Contact pins for test sockets and test sockets comprising the sameOKINS ELECTRONICS CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·13 claims
- 0664US12596137B2Pogo pin with adjustable elastic forceOKINS ELECTRONICS CO LTD·Filed 2024·Granted Apr 7, 2026·0 cites·10 claims
- 0757US12467946B2Test socketOKINS ELECTRONICS CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·10 claims
- 0856USD1024815SProbe for measuring electrical characteristicsOKINS ELECTRONICS CO LTD·Filed 2022·Granted Apr 30, 2024·2 cites·1 claims
- 0956US2021233789A1Magnetic colletOKINS ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 1054US2024361352A1Test socket and assembly device thereofOKINS ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1154US2024364050A1Test connectorOKINS ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1242US2021190822A1Multi-layer mems spring pinOKINS ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 1341US2021199692A1Probe pin having outer springOKINS ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 1431US2018188290A1Test socket, test socket manufacturing method, and jig assembly for test socketOKINS ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 1529US10506714B2MEMS film for semiconductor device test socket including MEMS bumpOKINS ELECTRONICS CO LTD·Filed 2015·Granted Dec 10, 2019·0 cites·2 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →