Magnetic collet

Abstract

Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.

What is claimed is: 
     
         1 . A magnetic collet comprising:
 adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof; and   a metal plate including a common hole, which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes, and stacked on the adsorption rubber.   
     
     
         2 . The magnetic collet of  claim 1 , wherein the plurality of individual holes are disposed in at least two rows in a direction from a first side of the contact surface toward a second surface corresponding to the first side. 
     
     
         3 . The magnetic collet of  claim 2 , wherein:
 the common hole has an “H” shape in which two first holes spaced apart from each other and a second hole connecting the first holes are formed; and   the plurality of individual holes are disposed in rows at positions corresponding to the first holes.   
     
     
         4 . The magnetic collet of  claim 1 , wherein the adsorption rubber further includes a common groove providing a common passage disposed in the contact surface and connected to the individual holes. 
     
     
         5 . The magnetic collet of  claim 1 , wherein the contact surface is formed to protrude from the one surface of the adsorption rubber. 
     
     
         6 . The magnetic collet of  claim 1 , wherein an open area of the plurality of individual holes in the contact surface is less than an open area thereof in the other surface of the adsorption rubber. 
     
     
         7 . The magnetic collet of  claim 1 , wherein the contact surface, which comes into contact with the semiconductor chip, of the adsorption rubber is formed in a round shape. 
     
     
         8 . The magnetic collet of  claim 7 , wherein a thickness of the round shape increases in a direction toward a central portion of the contact surface. 
     
     
         9 . The magnetic collet of  claim 7 , wherein a thickness of the round shape decreases in a direction from a central portion of the contact surface toward a first side and a second side positioned at both sides of the contact surface. 
     
     
         10 . A magnetic collet comprising:
 adsorption rubber in which a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to a protrusion formed on the other surface thereof are formed; and   a metal plate including an insertion hole formed therein and stacked on the adsorption rubber, wherein the protrusion of the adsorption rubber is insertion-coupled to the insertion hole.   
     
     
         11 . The magnetic collet of  claim 10 , wherein a first common groove connected to the individual holes is formed in the protrusion of the adsorption rubber. 
     
     
         12 . The magnetic collet of  claim 10 , wherein the plurality of individual holes are disposed in at least two rows in a direction from a first side of the contact surface toward a second side thereof. 
     
     
         13 . The magnetic collet of  claim 11 , wherein a second common hole connected to the individual holes is formed in the contact surface of the adsorption rubber. 
     
     
         14 . The magnetic collet of  claim 13 , wherein a diameter of a passage of a first common hole is less than a diameter of a passage of the second common hole. 
     
     
         15 . The magnetic collet of  claim 10 , wherein the contact surface is formed to protrude from the one surface of the adsorption rubber. 
     
     
         16 . The magnetic collet of  claim 10 , wherein an open area of the plurality of individual holes in the contact surface is less than an open area thereof in the protrusion. 
     
     
         17 . The magnetic collet of  claim 10 , wherein the contact surface, which comes into contact with the semiconductor chip, of the adsorption rubber is formed in a round shape. 
     
     
         18 . The magnetic collet of  claim 17 , wherein a thickness of the round shape increases in a direction toward a central portion of the contact surface. 
     
     
         19 . The magnetic collet of  claim 17 , wherein a thickness of the round shape decreases in a direction from a central portion of the contact surface toward a first side and a second side positioned at both sides of the contact surface.