Assignee
OTSUKA KANJI
JP·12 granted patents·2 pending applications·358 citations·filing 1999–2012
Top patents by PatentIndex Score
14 records- 0196US7446567B2Signal transmission apparatus and interconnection structureOTSUKA KANJI·Filed 2004·Granted Nov 4, 2008·199 cites·29 claims
- 0287US6670830B2Driver circuit, receiver circuit, and signal transmission bus systemOTSUKA KANJI·Filed 2001·Granted Dec 30, 2003·53 cites·74 claims
- 0375US6522173B1Electronic deviceOTSUKA KANJI·Filed 1999·Granted Feb 18, 2003·40 cites·22 claims
- 0469US6693801B2Electronic deviceOTSUKA KANJI·Filed 2002·Granted Feb 17, 2004·13 cites·9 claims
- 0566US6373275B1Electronic device capable of greatly improving signal transmission speed in a bus wiring systemOTSUKA KANJI·Filed 1999·Granted Apr 16, 2002·33 cites·26 claims
- 0660US7173449B2Signal transmission systemOTSUKA KANJI·Filed 2003·Granted Feb 6, 2007·9 cites·11 claims
- 0754US8305789B2Memory/logic conjugate systemOTSUKA KANJI·Filed 2010·Granted Nov 6, 2012·1 cites·20 claims
- 0853US6812742B2Electronic deviceOTSUKA KANJI·Filed 2002·Granted Nov 2, 2004·5 cites·23 claims
- 0952US6731153B2Semiconductor integrated circuit having switching transistors and varactorsOTSUKA KANJI·Filed 2001·Granted May 4, 2004·5 cites·8 claims
- 1051US2011073352A1Paired low-characteristic impedance power line and ground line structureOTSUKA KANJI·Filed 2009·Application pending·0 cites
- 1150US2013061004A1Memory/logic conjugate systemOTSUKA KANJI·Filed 2012·Application pending·0 cites
- 1249US7631422B2Method of manufacturing wiring substrate having terminated busesOTSUKA KANJI·Filed 2006·Granted Dec 15, 2009·0 cites·1 claims
- 1339US7446625B2Narrow impedance conversion deviceOTSUKA KANJI·Filed 2006·Granted Nov 4, 2008·0 cites·11 claims
- 1436US8217466B2High-speed semiconductor device and method for manufacturing the sameOTSUKA KANJI·Filed 2006·Granted Jul 10, 2012·0 cites·11 claims
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