Assignee
PARK MYUNG-BEOM
KR·1 granted patent·3 pending applications·0 citations·filing 2009–2011
Top patents by PatentIndex Score
4 records- 0140US2009233439A1Method of forming an ohmic layer and method of forming a metal wiring of a semiconductor device using the samePARK MYUNG-BEOM·Filed 2009·Application pending·0 cites
- 0234US2010084277A1Composition for copper plating and associated methodsPARK MYUNG-BEOM·Filed 2009·Application pending·0 cites
- 0331US8795505B2Copper electroplating methodPARK MYUNG-BEOM·Filed 2011·Granted Aug 5, 2014·0 cites·14 claims
- 0430US2012193238A1Compositions For Plating Copper And Methods Of Forming A Copper Bump Using The SamePARK MYUNG-BEOM·Filed 2011·Application pending·0 cites
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