Assignee
PHOENIX PIONEER TECHNOLOGY CO LTD
TW·75 granted patents·36 pending applications·55 citations·filing 2014–2025
Top patents by PatentIndex Score
111 records- 0197US11757426B2Manufacturing method for surface acoustic wave filter package structurePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2022·Granted Sep 12, 2023·3 cites·5 claims
- 0295US11749612B2Semiconductor package devicePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2021·Granted Sep 5, 2023·3 cites·10 claims
- 0393US11798909B2Semiconductor package structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2021·Granted Oct 24, 2023·2 cites·7 claims
- 0489US10475752B2Semiconductor package structure and method of making the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2017·Granted Nov 12, 2019·5 cites·6 claims
- 0585US9754982B2Packaging module and substrate structure thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Sep 5, 2017·5 cites·20 claims
- 0684US9214437B1Package methodPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted Dec 15, 2015·6 cites·9 claims
- 0783US10117340B2Manufacturing method of package substrate with metal on conductive portionsPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2018·Granted Oct 30, 2018·3 cites·5 claims
- 0881US11183447B2Flip-chip package substrate and method for fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2020·Granted Nov 23, 2021·1 cites·10 claims
- 0981US9583436B2Package apparatus and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2015·Granted Feb 28, 2017·5 cites·9 claims
- 1076US11476204B2Flip-chip packaging substrate and method for fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2019·Granted Oct 18, 2022·2 cites·3 claims
- 1176US2025372299A1Manufacturing method of composite-type micro-inductorPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 1275US10079220B2Package substrate having a plurality of chips electrically connected by conductive vias and wiring bondingPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2017·Granted Sep 18, 2018·2 cites·6 claims
- 1374US12476378B2Antenna module, antenna supporting substrate and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·11 claims
- 1473US2025316415A1Inductor structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 1572US12080670B2Manufacturing method of semiconductor package structurePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Granted Sep 3, 2024·0 cites·9 claims
- 1671US9805996B2Substrate structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Oct 31, 2017·2 cites·4 claims
- 1771US9342772B2Substrate structure and method of manufacturing the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted May 17, 2016·2 cites·9 claims
- 1871US2026032814A1Semiconductor package carrier board structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 1969US9824964B2Package substrate, package structure including the same, and their fabrication methodsPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2017·Granted Nov 21, 2017·1 cites·6 claims
- 2069US2025140467A1Inductive structurePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2024·Application pending·0 cites
- 2167US11069540B2Package on package and a method of fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted Jul 20, 2021·2 cites·6 claims
- 2266US12154866B2Method of fabricating a flip-chip package core substrate with build-up layersPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2022·Granted Nov 26, 2024·0 cites·2 claims
- 2366US9548234B2Package substrate and flip-chip package circuit including the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted Jan 17, 2017·1 cites·9 claims
- 2466US2024221999A1Inductor structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 2566US2026033347A1Semiconductor package carrier structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 2665US9711445B2Package substrate, package structure including the same, and their fabrication methodsPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Jul 18, 2017·1 cites·8 claims
- 2765US9536864B2Package structure and its fabrication methodPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted Jan 3, 2017·1 cites·10 claims
- 2865US2025174874A1Hollow Antenna Substrate and Its Manufacturing Method for Antenna Packaging ApplicationsPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2024·Application pending·0 cites
- 2964US10483232B2Method for fabricating bump structures on chips with panel type processPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2017·Granted Nov 19, 2019·1 cites·12 claims
- 3064US10014242B2Interposer substrate and method of fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2015·Granted Jul 3, 2018·1 cites·3 claims
- 3164US9831217B2Method of fabricating package substratesPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2017·Granted Nov 28, 2017·1 cites·10 claims
- 3264US9613894B2Electronic packagePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Apr 4, 2017·1 cites·16 claims
- 3364US2025218795A1Method for manufacturing package substratePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2024·Application pending·0 cites
- 3464US2024215174A1Package carrier board integrated with magnetic element structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 3563US12347919B2Semiconductor package antenna structure and its manufacturing methodPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·11 claims
- 3663US10204865B2Electronic package and conductive structure thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Feb 12, 2019·1 cites·18 claims
- 3763US9338900B2Interposer substrate and method of fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted May 10, 2016·1 cites·13 claims
- 3863US2025070073A1Embedded semiconductor packaging devicePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2024·Application pending·0 cites
- 3962US9370105B2Package apparatus with multiple pillar layersPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted Jun 14, 2016·1 cites·40 claims
- 4062US2025142728A1Coil carrier board and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2024·Application pending·0 cites
- 4160US12094922B2Inductance traces protected through shielding layersPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·16 claims
- 4260US9589935B2Package apparatus and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2014·Granted Mar 7, 2017·1 cites·20 claims
- 4360US2024145155A1Core structure of inductor element and method of manufacturing the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 4460US2024194386A1Inductor structure, magnetically permeable body and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 4560US2024222140A1Package carrier board integrated with inductive circuit structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 4659US12080466B2Electronic packagePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·22 claims
- 4759US2024161957A1Inductor structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 4859US2026005116A1Semiconductor packaging substrate structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 4959US2020332429A1Method of fabricating package substratesPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2020·Application pending·0 cites
- 5058US11387806B2Surface acoustic wave filter package structure and method of manufacturing the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2019·Granted Jul 12, 2022·0 cites·9 claims
Showing the top 50 of 111 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when PHOENIX PIONEER TECHNOLOGY CO LTD files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →