Package apparatus and manufacturing method thereof

Abstract

A package apparatus includes a first package module, a second package module and multiple conductive elements. The first package module includes a first molding compound layer, a first conductive pillar layer disposed in the first molding compound layer, a first internal component, and a first protection layer. The first internal component electrically connects to the first conductive pillar layer and disposed in the first molding compound layer. The first protection layer is disposed on the first molding compound layer and the first conductive pillar layer. The second package module includes a second molding compound layer, a second conductive pillar layer disposed in the second molding compound layer, and a second internal component. The second internal component electrically connects to the second conductive pillar layer and disposed in the second molding compound layer. The conductive elements are disposed between the first and the second conductive pillar layers.

What is claimed is: 
     
       1. A package apparatus, comprising:
 a first package module, comprising:
 a first molding compound layer; 
 a first conductive pillar layer, disposed in the first molding compound layer, comprising:
 a plurality of first surfaces facing a first direction; and 
 a plurality of second surfaces facing a second direction opposite to said first direction; 
 
 a first internal component disposed in the first molding compound layer and electrically connected to the first conductive pillar layer; and 
 a first protection layer disposed on the first molding compound layer and the first surfaces; 
 
 a second package module, comprising:
 a second molding compound layer; 
 a second conductive pillar layer, disposed in the second molding compound layer, comprising:
 a plurality of third surfaces, facing said second direction; and 
 a plurality of fourth surfaces facing said first direction; and 
 
 a second internal component disposed in the second molding compound layer and electrically connected to the second conductive pillar layer; and 
 
 a plurality of conductive elements disposed between the first conductive pillar layer and the second conductive pillar layer, 
 wherein the first molding compound layer has a plurality of grooves intercalated with said plurality of second surfaces on its upper surface, or the second molding compound layer has a plurality of grooves intercalated with said plurality of fourth surfaces on its lower surface, each groove having:
 an opening, and 
 a basin, spaced from said first conductive pillar layer and said second conductive pillar layer, below the second or fourth surfaces, 
 wherein said opening is wider than said basin. 
 
 
     
     
       2. The package apparatus of  claim 1 , wherein the second package module comprises a second protection layer disposed on the second molding compound layer and the third surfaces. 
     
     
       3. The package apparatus of  claim 1 , further comprising a first adhesive layer disposed between the first molding compound layer and the second molding compound layer, wherein the plural conductive elements are disposed on the first adhesive layer. 
     
     
       4. The package apparatus of  claim 1 , wherein the second surfaces are not higher than the surface of the first molding compound layer. 
     
     
       5. The package apparatus of  claim 1 , wherein the fourth surfaces are not higher than the surface of the second molding compound layer. 
     
     
       6. The package apparatus of  claim 4 , wherein the first molding compound layer is formed covering all the lateral surface of the first conductive pillar layer. 
     
     
       7. The package apparatus of  claim 5 , wherein the second molding compound layer is formed covering all the lateral surface of the second conductive pillar layer. 
     
     
       8. The package apparatus of  claim 1 , wherein the second surfaces are not higher than the first molding compound layer, and the fourth surfaces are higher than the second molding compound layer. 
     
     
       9. The package apparatus of  claim 8 , wherein the first molding compound layer is formed covering all the lateral surface of the second surfaces, and the second molding compound layer is formed covering a portion of the lateral surface of the fourth surfaces. 
     
     
       10. The package apparatus of  claim 1 , wherein the first and the second molding compound layers are made of a molding compound material that is selected from a novolac-based resin, an epoxy-based resin, or a silicon-based resin. 
     
     
       11. The package apparatus of  claim 1 , further comprising at least one wire or at least one chip seat disposed between the second surfaces and the fourth surfaces. 
     
     
       12. The package apparatus of  claim 1 , wherein each of the first and the second internal components is an active component or a passive element. 
     
     
       13. The package apparatus of  claim 1 , wherein the plural conductive elements are disposed inside an area enclosed and defined by the first internal component and the second internal component. 
     
     
       14. The package apparatus of  claim 1 , wherein the plural conductive elements are disposed outside an area enclosed and defined by the first internal component and the second internal component. 
     
     
       15. The package apparatus of  claim 1 , wherein the plural conductive elements are disposed between the second surfaces and the fourth surfaces. 
     
     
       16. The package apparatus of  claim 1 , wherein the plural conductive elements are disposed between the second surfaces and the third surfaces. 
     
     
       17. The package apparatus of  claim 1 , further comprising a third package module electrically connected to the second package module by the plural conductive elements. 
     
     
       18. The package apparatus of  claim 17 , wherein the third package module further comprising:
 a third molding compound layer; 
 a third conductive pillar layer disposed in the third molding compound layer; and 
 a third internal component disposed in the third molding compound layer and electrically connected to the third conductive pillar layer. 
 
     
     
       19. A method for manufacturing a package apparatus, comprising:
 providing a first package module, comprising:
 a first molding compound layer; 
 
  a first conductive pillar layer, disposed in the first molding compound layer, comprising:
 a plurality of first surfaces facing a first direction; and 
 a plurality of second surfaces facing a second direction opposite to said first direction; 
 
  a first internal component disposed in the first molding compound layer and electrically connected to the first conductive pillar layer; and 
  a first protection layer disposed on the first molding compound layer and the first surfaces; 
 providing a second package module, comprising:
 a second molding compound layer; 
 
  a second conductive pillar layer, disposed in the second molding compound layer, comprising:
 a plurality of third surfaces, facing said second direction; and 
 a plurality of fourth surfaces facing said first direction; and 
 
  a second internal component disposed in the second molding compound layer and electrically connected to the second conductive pillar layer; and 
 providing a plurality of conductive elements disposed between the first conductive pillar layer and the second conductive pillar layer, 
 wherein the first molding compound layer has a plurality of grooves intercalated with said plurality of second surfaces on its upper surface, or the second molding compound layer has a plurality of grooves intercalated with said plurality of fourth surfaces on its lower surface, each groove having:
 an opening, and 
 a basin, spaced from said first conductive pillar layer and said second conductive pillar layer, below the second or fourth surfaces, wherein said opening is wider than said basin. 
 
 
     
     
       20. The method for manufacturing a package apparatus of  claim 19 , wherein the step of providing a first package module comprises electrically connecting the first internal component to the first conductive pillar layer by either wiring bonding or bump bonding, and the step of providing a second package module comprises electrically connecting the second internal component to the second conductive pillar layer by either wiring bonding or bump bonding.