Inventor

HU CHU-CHIN

TW22 patents

⚠️ This page may combine multiple inventors who share the name “HU CHU-CHIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HU CHU-CHIN

PHOENIX PIONEER TECHNOLOGY CO LTD

Package substrate having a plurality of chips electrically connected by conductive vias and wiring bonding

Packaging module and substrate structure thereof

Electronic package and conductive structure thereof

Intermediate substrate and fabrication method thereof

Flip-chip package substrate

Electronic package

Package apparatus and manufacturing method thereof

Method of fabricating package substrates

Electronic package

Package apparatus and manufacturing method thereof

PHOENIX PREC TECHNOLOGY CORP

Direct connection multi-chip semiconductor element structure

Integrated library core for embedded passive components and method for forming electronic device thereon

Substrate for pre-soldering material and fabrication method thereof

Substrate for pre-soldering material and fabrication method thereof

Method and structure for producing bumps on an IC package substrate

PHOENIX & CORP

Packaging substrate and method of fabricating the same

Package substrate and associated fabrication method with varying depths for circuit device terminals

Method of fabricating packaging substrate

HU CHU-CHIN

Package stack device and fabrication method thereof

Fabrication method of package structure

UNIMICRON TECHNOLOGY CORP

Carrier board structure with embedded semiconductor chip and fabrication method thereof

ZHEN DING TECHNOLOGY CO LTD

Packaging substrate, method for manufacturing same, and chip packaging body having same