Inventor
CHOU E-TUNG
TW10 patents
⚠️ This page may combine multiple inventors who share the name “CHOU E-TUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ZHEN DING TECHNOLOGY CO LTD
5 patentsUS8951848B2Feb 10, 2015
Circuit substrate for mounting chip, method for manufacturing same and chip package having same
ZHEN DING TECHNOLOGY CO LTD1 citations49
US9357647B2May 31, 2016
Packaging substrate, method for manufacturing same, and chip packaging body having same
ZHEN DING TECHNOLOGY CO LTD0 citations40
US9362248B2Jun 7, 2016
Coreless package structure and method for manufacturing same
ZHEN DING TECHNOLOGY CO LTD0 citations31
US9173298B2Oct 27, 2015
Packaging substrate, method for manufacturing same, and chip packaging structure having same
ZHEN DING TECHNOLOGY CO LTD0 citations31
US9165790B2Oct 20, 2015
Packaging substrate, method for manufacturing same, and chip packaging body having same
ZHEN DING TECHNOLOGY CO LTD0 citations31
PHOENIX PIONEER TECHNOLOGY CO LTD
3 patentsUS9589935B2Mar 7, 2017
Package apparatus and manufacturing method thereof
PHOENIX PIONEER TECHNOLOGY CO LTD1 citations51
US12293976B2May 6, 2025
Semiconductor EMI shielding component, semiconductor package structure and manufacturing method thereof
PHOENIX PIONEER TECHNOLOGY CO LTD0 citations45
US9601402B2Mar 21, 2017
Package apparatus and manufacturing method thereof
PHOENIX PIONEER TECHNOLOGY CO LTD0 citations40
PHOENIX PREC TECHNOLOGY CORP
2 patentsUS7396753B2Jul 8, 2008
Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same
PHOENIX PREC TECHNOLOGY CORP14 citations80
US7399399B2Jul 15, 2008
Method for manufacturing semiconductor package substrate
PHOENIX PREC TECHNOLOGY CORP18 citations79