Assignee
PUNZALAN JEFFREY D
SG·6 granted patents·1 pending application·7 citations·filing 2005–2011
Technology mixH10W7
Top patents by PatentIndex Score
7 records- 0174US8633062B2Integrated circuit package system with integral inner lead and paddle and method of manufacture thereofPUNZALAN JEFFREY D·Filed 2010·Granted Jan 21, 2014·5 cites·18 claims
- 0261US8207597B2Integrated circuit package system with flashless leadsPUNZALAN JEFFREY D·Filed 2007·Granted Jun 26, 2012·2 cites·19 claims
- 0349US8415778B2Non-leaded integrated circuit package system with multiple ground sitesPUNZALAN JEFFREY D·Filed 2011·Granted Apr 9, 2013·0 cites·6 claims
- 0449US8062934B2Integrated circuit package system with ground bondsPUNZALAN JEFFREY D·Filed 2007·Granted Nov 22, 2011·0 cites·20 claims
- 0546US8278148B2Integrated circuit package system with leads separated from a die paddlePUNZALAN JEFFREY D·Filed 2007·Granted Oct 2, 2012·0 cites·14 claims
- 0645US2011204501A1Integrated circuit packaging system including non-leaded packagePUNZALAN JEFFREY D·Filed 2011·Application pending·0 cites
- 0743US8399968B2Non-leaded integrated circuit package systemPUNZALAN JEFFREY D·Filed 2005·Granted Mar 19, 2013·0 cites·20 claims
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