Integrated circuit packaging system including non-leaded package

Abstract

An integrated circuit packaging system includes: a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads; each one of the plurality of leads includes first terminal ends disposed adjacent an integrated circuit and second terminal ends disposed along a periphery of a package; and a lead-to-lead gap formed between the second terminal ends of alternating leads in excess of the predetermined interval gap.

1 . An integrated circuit packaging system comprising:
 a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads;   each one of the plurality of leads includes first terminal ends disposed adjacent an integrated circuit and second terminal ends disposed along a periphery of a package; and   a lead-to-lead gap formed between the second terminal ends of alternating leads in excess of the predetermined interval gap.   
     
     
         2 . The system as claimed in  claim 1  wherein:
 the second terminal ends of the alternating leads form a projection with or without an angled base. 
 
     
     
         3 . The system as claimed in  claim 1  wherein:
 all of the second terminal ends form a projection with or without an angled base. 
 
     
     
         4 . The system as claimed in  claim 1  wherein:
 the second terminal ends include a top portion removed to prevent lead-to-lead shorting. 
 
     
     
         5 . The system as claimed in  claim 1  wherein:
 the plurality of leads are configured to either be one of a dual row quad flat non-leaded package or a single row quad flat non-leaded package. 
 
     
     
         6 . An integrated circuit packaging system comprising:
 an integrated circuit pad;   an integrated circuit, with contact terminals, disposed over the integrated circuit pad;   a plurality of leads disposed peripherally around the integrated circuit electrically connected to the contact terminals by wires;   a mold resin for packaging the integrated circuit defining a system periphery; and   
       wherein:
 the plurality of leads include first terminal ends and second terminal ends, the first terminal ends disposed adjacent the integrated circuit and the second terminal ends disposed along a periphery of the system; and 
 the second terminal ends of alternating leads include a top portion removed, to form an etched lead-to-lead gap. 
 
     
     
         7 . The system as claimed in  claim 6  wherein:
 the second terminal ends of the alternating leads are configured with or without an angled base. 
 
     
     
         8 . The system as claimed in  claim 6  further comprising:
 all of the second terminal ends including a top portion removed to prevent lead-to-lead shorting. 
 
     
     
         9 . The system as claimed in  claim 6  wherein:
 the etched lead-to-lead gap is larger than a predetermined interval gap. 
 
     
     
         10 . The system as claimed in  claim 6  wherein:
 the plurality of leads are configured to either be one of a dual row quad flat non-leaded package or a single row quad flat non-leaded package.