Inventor · disambiguated record
Jeffrey D. Punzalan
Also filed as: PUNZALAN JEFFREY · PUNZALAN JEFFREY D · PUNZALAN JEFFREY DAVID
76 granted patents·14 pending applications·621 citations·filing 2002–2024
99Inventor score
Files withSTATS CHIPPAC LTD34UTAC HEADQUARTERS PTE LTD16CAMACHO ZIGMUND RAMIREZ10PUNZALAN JEFFREY D7ST ASSEMBLY TEST SERVICES LTD7
Top patents by PatentIndex Score
90 records- 0197US7915716B2Integrated circuit package system with leadframe arraySTATS CHIPPAC LTD·Filed 2007·Granted Mar 29, 2011·62 cites·18 claims
- 0296US7977579B2Multiple flip-chip integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jul 12, 2011·40 cites·20 claims
- 0395US7888181B2Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor dieSTATS CHIPPAC LTD·Filed 2008·Granted Feb 15, 2011·25 cites·23 claims
- 0494US7400049B2Integrated circuit package system with heat sinkSTATS CHIPPAC LTD·Filed 2006·Granted Jul 15, 2008·34 cites·12 claims
- 0593US8035204B2Large die package structures and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2010·Granted Oct 11, 2011·13 cites·12 claims
- 0692US7443015B2Integrated circuit package system with downset leadSTATS CHIPPAC LTD·Filed 2006·Granted Oct 28, 2008·28 cites·13 claims
- 0790US7868471B2Integrated circuit package-in-package system with leadsSTATS CHIPPAC LTD·Filed 2007·Granted Jan 11, 2011·22 cites·8 claims
- 0890US7700404B2Large die package structures and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2006·Granted Apr 20, 2010·16 cites·16 claims
- 0990US7563647B2Integrated circuit package system with interconnect supportSTATS CHIPPAC LTD·Filed 2006·Granted Jul 21, 2009·17 cites·14 claims
- 1089US8395251B2Integrated circuit package to package stacking systemSHIM IL KWON·Filed 2006·Granted Mar 12, 2013·18 cites·14 claims
- 1188US12100719B2Reliable semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Sep 24, 2024·1 cites·20 claims
- 1288US6630373B2Ground plane for exposed packageST ASSEMBLY TEST SERVICE LTD·Filed 2002·Granted Oct 7, 2003·46 cites·15 claims
- 1386US8120149B2Integrated circuit package systemCAMACHO ZIGMUND RAMIREZ·Filed 2006·Granted Feb 21, 2012·14 cites·20 claims
- 1486US7479692B2Integrated circuit package system with heat sinkSTATS CHIPPAC LTD·Filed 2006·Granted Jan 20, 2009·13 cites·20 claims
- 1585US8120156B2Integrated circuit package system with die on base packageCAMACHO ZIGMUND RAMIREZ·Filed 2006·Granted Feb 21, 2012·13 cites·20 claims
- 1685US7339258B2Dual row leadframe and fabrication methodST ASSEMBLY TEST SERVICES LTD·Filed 2006·Granted Mar 4, 2008·11 cites·10 claims
- 1785US7298026B2Large die package and method for the fabrication thereofSTATS CHIPPAC LTD·Filed 2005·Granted Nov 20, 2007·13 cites·16 claims
- 1884US7901996B2Integrated circuit package system with interconnection support and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Mar 8, 2011·9 cites·14 claims
- 1984US7554179B2Multi-leadframe semiconductor package and method of manufactureSTATS CHIPPAC LTD·Filed 2005·Granted Jun 30, 2009·12 cites·20 claims
- 2084US7129569B2Large die package structures and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Oct 31, 2006·28 cites·16 claims
- 2183US9355983B1Integrated circuit packaging system with interposer structure and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2014·Granted May 31, 2016·5 cites·15 claims
- 2282US9305809B1Integrated circuit packaging system with coreless substrate and method of manufacture thereofESPIRITU EMMANUEL·Filed 2014·Granted Apr 5, 2016·6 cites·20 claims
- 2381US8203214B2Integrated circuit package in package system with adhesiveless package attachBATHAN HENRY DESCALZO·Filed 2007·Granted Jun 19, 2012·7 cites·20 claims
- 2481US7274089B2Integrated circuit package system with adhesive restraintSTATS CHIPPAC LTD·Filed 2005·Granted Sep 25, 2007·9 cites·20 claims
- 2581US7060536B2Dual row leadframe and fabrication methodST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Jun 13, 2006·26 cites·9 claims
- 2680US7777310B2Integrated circuit package system with integral inner lead and paddleSTATS CHIPPAC LTD·Filed 2007·Granted Aug 17, 2010·7 cites·15 claims
- 2780US2024421169A1Reliable semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2024·Application pending·0 cites
- 2879US8803300B2Integrated circuit packaging system with protective coating and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2010·Granted Aug 12, 2014·5 cites·16 claims
- 2979US7545032B2Integrated circuit package system with stiffenerSTATS CHIPPAC LTD·Filed 2006·Granted Jun 9, 2009·8 cites·20 claims
- 3078US9412624B1Integrated circuit packaging system with substrate and method of manufacture thereofCUONG DAO NGUYEN PHU·Filed 2014·Granted Aug 9, 2016·6 cites·20 claims
- 3177US8493748B2Packaging system with hollow package and method for the sameCAMACHO ZIGMUND RAMIREZ·Filed 2007·Granted Jul 23, 2013·7 cites·18 claims
- 3277US7449369B2Integrated circuit package system with multiple moldingSTATS CHIPPAC LTD·Filed 2006·Granted Nov 11, 2008·6 cites·11 claims
- 3377US7365417B2Overhang integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Apr 29, 2008·7 cites·17 claims
- 3475US7915724B2Integrated circuit packaging system with base structure deviceSTATS CHIPPAC LTD·Filed 2007·Granted Mar 29, 2011·6 cites·20 claims
- 3575US7759806B2Integrated circuit package system with multiple device unitsSTATS CHIPPAC LTD·Filed 2007·Granted Jul 20, 2010·5 cites·12 claims
- 3675US7541221B2Integrated circuit package system with leadfinger supportSTATS CHIPPAC LTD·Filed 2006·Granted Jun 2, 2009·5 cites·8 claims
- 3775US7479409B2Integrated circuit package with elevated edge leadframeSTATS CHIPPAC LTD·Filed 2006·Granted Jan 20, 2009·6 cites·20 claims
- 3875US2025126909A1Reliable semiconductors packagesUTAC HEADQUARTERS PTE LTD·Filed 2024·Application pending·0 cites
- 3974US8633062B2Integrated circuit package system with integral inner lead and paddle and method of manufacture thereofPUNZALAN JEFFREY D·Filed 2010·Granted Jan 21, 2014·5 cites·18 claims
- 4073US8362601B2Wire-on-lead package system having leadfingers positioned between paddle extensions and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted Jan 29, 2013·5 cites·20 claims
- 4173US8039947B2Integrated circuit package system with different mold locking featuresSTATS CHIPPAC LTD·Filed 2007·Granted Oct 18, 2011·5 cites·20 claims
- 4272US8546189B2Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnectionCAMACHO ZIGMUND R·Filed 2009·Granted Oct 1, 2013·4 cites·22 claims
- 4370US8633578B2Integrated circuit package system with laminate baseCAMACHO ZIGMUND RAMIREZ·Filed 2011·Granted Jan 21, 2014·2 cites·9 claims
- 4470US7936053B2Integrated circuit package system with lead structures including a dummy tie barSTATS CHIPPAC LTD·Filed 2006·Granted May 3, 2011·4 cites·20 claims
- 4569US7993939B2Integrated circuit package system with laminate baseSTATS CHIPPAC LTD·Filed 2006·Granted Aug 9, 2011·3 cites·10 claims
- 4669US7217599B2Integrated circuit package with leadframe locked encapsulation and method of manufacture thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted May 15, 2007·13 cites·9 claims
- 4768US11881494B2Semiconductor package with damsUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Jan 23, 2024·0 cites·20 claims
- 4867US7947534B2Integrated circuit packaging system including a non-leaded packageSTATS CHIPPAC LTD·Filed 2006·Granted May 24, 2011·3 cites·9 claims
- 4967US7671463B2Integrated circuit package system with ground ringSTATS CHIPPAC LTD·Filed 2006·Granted Mar 2, 2010·3 cites·20 claims
- 5067US7498665B2Integrated circuit leadless package systemSTATS CHIPPAC LTD·Filed 2006·Granted Mar 3, 2009·3 cites·20 claims
Showing the top 50 of 90 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →