Assignee
SAKUMA KATSUYUKI
US·2 granted patents·1 pending application·7 citations·filing 2012–2014
Top patents by PatentIndex Score
3 records- 0179US9385039B2Formation of through-silicon via (TSV) in silicon substrateSAKUMA KATSUYUKI·Filed 2014·Granted Jul 5, 2016·4 cites·1 claims
- 0274US8987131B2Formation of through-silicon via (TSV) in silicon substrateSAKUMA KATSUYUKI·Filed 2012·Granted Mar 24, 2015·3 cites·1 claims
- 0348US2012286428A1Formation of through-silicon via (tsv) in silicon substrateSAKUMA KATSUYUKI·Filed 2012·Application pending·0 cites
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