Assignee
SCHWEIZER ELECTRONIC AG
DE·17 granted patents·3 pending applications·10 citations·filing 2014–2023
Top patents by PatentIndex Score
20 records- 0179US10229895B2Electronic sub-assembly and method for the production of an electronic sub-assemblySCHWEIZER ELECTRONIC AG·Filed 2014·Granted Mar 12, 2019·4 cites·8 claims
- 0274US10121737B2Printed circuit board element and method for producing a printed circuit board elementSCHWEIZER ELECTRONIC AG·Filed 2017·Granted Nov 6, 2018·3 cites·24 claims
- 0367US10834810B2Circuit board and method for production thereofSCHWEIZER ELECTRONIC AG·Filed 2017·Granted Nov 10, 2020·1 cites·15 claims
- 0466US10777503B2Method for contacting a metallic contact pad in a printed circuit board and printed circuit boardSCHWEIZER ELECTRONIC AG·Filed 2018·Granted Sep 15, 2020·1 cites·20 claims
- 0566US10673123B2Radio frequency transmitting/receiving element and method for producing a radio frequency transmitting/receiving elementSCHWEIZER ELECTRONIC AG·Filed 2017·Granted Jun 2, 2020·1 cites·20 claims
- 0663US12028963B2Printed circuit board module, printed circuit board element, heatsink, heat-conducting element and method of producing a thermally conductive layerSCHWEIZER ELECTRONIC AG·Filed 2021·Granted Jul 2, 2024·0 cites·3 claims
- 0760US2024222208A1Power electronic module, power electronic module block, printed circuit board with power electronic module or printed circuit board component,and method for producing a power electronic moduleSCHWEIZER ELECTRONIC AG·Filed 2023·Application pending·0 cites
- 0849US10154593B2Electronic assembly group and method for producing the sameSCHWEIZER ELECTRONIC AG·Filed 2016·Granted Dec 11, 2018·0 cites·15 claims
- 0949US2014145565A1Electronic Assembly Group and Method for Producing the SameSCHWEIZER ELECTRONIC AG·Filed 2014·Application pending·0 cites
- 1048US10462905B2Printed circuit board element with integrated electronic switching element, power converter and method for producing a printed circuit board elementSCHWEIZER ELECTRONIC AG·Filed 2019·Granted Oct 29, 2019·0 cites·15 claims
- 1148US9913378B2Electronic sub-assembly, a method for manufacturing the same, and a printed circuit board with electronic sub-assemblySCHWEIZER ELECTRONIC AG·Filed 2014·Granted Mar 6, 2018·0 cites·16 claims
- 1248US2021168943A1Method for manufacturing a conductor structural element and conductor structural elementSCHWEIZER ELECTRONIC AG·Filed 2020·Application pending·0 cites
- 1346US10555419B2Conductor-structure element having an internal layer substrate laminated into same, and method for the production thereofSCHWEIZER ELECTRONIC AG·Filed 2016·Granted Feb 4, 2020·0 cites·26 claims
- 1445US10424536B2Electronic component having a lead frame consisting of an electrically conductive materialSCHWEIZER ELECTRONIC AG·Filed 2018·Granted Sep 24, 2019·0 cites·17 claims
- 1543US10964635B2Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their makingSCHWEIZER ELECTRONIC AG·Filed 2019·Granted Mar 30, 2021·0 cites·9 claims
- 1642US10600705B2Electronic switching element and modularly constructed power converterSCHWEIZER ELECTRONIC AG·Filed 2016·Granted Mar 24, 2020·0 cites·28 claims
- 1742US10212802B2Electronic device and method for producing an electronic deviceSCHWEIZER ELECTRONIC AG·Filed 2017·Granted Feb 19, 2019·0 cites·15 claims
- 1839US10602606B2Radio-frequency antenna, radio-frequency substrate with radio-frequency antenna, and production methodSCHWEIZER ELECTRONIC AG·Filed 2016·Granted Mar 24, 2020·0 cites·21 claims
- 1936US9848499B2Method for producing a circuit board and circuit boardSCHWEIZER ELECTRONIC AG·Filed 2015·Granted Dec 19, 2017·0 cites·12 claims
- 2031US10477693B2Method for manufacturing a printed circuit board element and printed circuit board elementSCHWEIZER ELECTRONIC AG·Filed 2017·Granted Nov 12, 2019·0 cites·13 claims
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