Assignee
SEMILEDS OPTOELECTRONICS CO
TW·38 granted patents·7 pending applications·204 citations·filing 2006–2024
Top patents by PatentIndex Score
45 records- 0198US11817536B2Method for making electronic device arrays using a temporary substrate and a carrier substrateSEMILEDS OPTOELECTRONICS CO·Filed 2022·Granted Nov 14, 2023·4 cites·16 claims
- 0297US11387397B2Method for making light emitting device (LED) arrays using a temporary substrate and a carrier substrateSEMILEDS OPTOELECTRONICS CO·Filed 2020·Granted Jul 12, 2022·3 cites·16 claims
- 0397US8871547B2Method for fabricating vertical light emitting diode (VLED) structure using a laser pulse to remove a carrier substrateSEMILEDS OPTOELECTRONICS CO·Filed 2014·Granted Oct 28, 2014·23 cites·17 claims
- 0496US7897420B2Light emitting diodes (LEDs) with improved light extraction by rougheningSEMILEDS OPTOELECTRONICS CO·Filed 2007·Granted Mar 1, 2011·35 cites·16 claims
- 0592US11728461B2Single light emitting diode (LED) structure having epitaxial structure separated into light emitting zonesSEMILEDS OPTOELECTRONICS CO·Filed 2020·Granted Aug 15, 2023·2 cites·12 claims
- 0690US10910535B2Method for making light emitting device LED arraysSEMILEDS OPTOELECTRONICS CO·Filed 2018·Granted Feb 2, 2021·4 cites·14 claims
- 0790US8003994B2Vertical LED with current guiding structureSEMILEDS OPTOELECTRONICS CO·Filed 2010·Granted Aug 23, 2011·10 cites·27 claims
- 0889US7852015B1Solid state lighting system and maintenance method thereinSEMILEDS OPTOELECTRONICS CO·Filed 2006·Granted Dec 14, 2010·46 cites·28 claims
- 0988US2025143048A1Method for making electronic device arrays using a temporary substrateSEMILEDS OPTOELECTRONICS CO·Filed 2024·Application pending·0 cites
- 1086US8373195B2Light-emitting diode lamp with low thermal resistanceSEMILEDS OPTOELECTRONICS CO·Filed 2011·Granted Feb 12, 2013·8 cites·10 claims
- 1184US12191434B2Method for making electronic device arrays using a temporary substrateSEMILEDS OPTOELECTRONICS CO·Filed 2023·Granted Jan 7, 2025·0 cites·15 claims
- 1282US8012774B2Coating process for a light-emitting diode (LED)SEMILEDS OPTOELECTRONICS CO·Filed 2006·Granted Sep 6, 2011·11 cites·14 claims
- 1380US12206051B2Light emitting diode (LED) structure having single epitaxial structure separated into light emitting zonesSEMILEDS OPTOELECTRONICS CO·Filed 2023·Granted Jan 21, 2025·0 cites·12 claims
- 1480US10964851B2Single light emitting diode (LED) structureSEMILEDS OPTOELECTRONICS CO·Filed 2018·Granted Mar 30, 2021·2 cites·18 claims
- 1580US9214456B2Light emitting diode (LED) system having lighting device and wireless control systemSEMILEDS OPTOELECTRONICS CO·Filed 2012·Granted Dec 15, 2015·5 cites·15 claims
- 1679US8722433B2Method for fabricating light emitting diode (LED) dice with wavelength conversion layersSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted May 13, 2014·2 cites·20 claims
- 1778US8921204B2Method for fabricating semiconductor dice by separating a substrate from semiconductor structures using multiple laser pulsesSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Dec 30, 2014·4 cites·26 claims
- 1878US7863639B2Light-emitting diode lamp with low thermal resistanceSEMILEDS OPTOELECTRONICS CO·Filed 2006·Granted Jan 4, 2011·7 cites·23 claims
- 1977US9537073B2Method for fabricating a light emitting diode (LED) die having strap layerSEMILEDS OPTOELECTRONICS CO·Filed 2016·Granted Jan 3, 2017·2 cites·11 claims
- 2077US7968379B2Method of separating semiconductor diesSEMILEDS OPTOELECTRONICS CO·Filed 2008·Granted Jun 28, 2011·5 cites·51 claims
- 2174US9437794B2Method of fabricating a flip chip light emitting diode (FCLED) die having N-conductor layerSEMILEDS OPTOELECTRONICS CO·Filed 2016·Granted Sep 6, 2016·1 cites·10 claims
- 2271US9419195B2Light emitting diode (LED) die having strap layer and method of fabricationSEMILEDS OPTOELECTRONICS CO·Filed 2014·Granted Aug 16, 2016·1 cites·15 claims
- 2370US9343620B2Method for fabricating a light emitting diode (LED) die having protective substrateSEMILEDS OPTOELECTRONICS CO·Filed 2014·Granted May 17, 2016·2 cites·14 claims
- 2470US8716041B2Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer pathsSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted May 6, 2014·2 cites·19 claims
- 2569US8723160B2Light emitting diode (LED) die having peripheral electrode frame and method of fabricationSEMILEDS OPTOELECTRONICS CO·Filed 2012·Granted May 13, 2014·1 cites·20 claims
- 2663US8802465B2Method for handling a semiconductor wafer assemblySEMILEDS OPTOELECTRONICS CO·Filed 2012·Granted Aug 12, 2014·1 cites·10 claims
- 2763US8703515B2Method for guiding current in a light emitting diode (LED) deviceSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Apr 22, 2014·1 cites·8 claims
- 2861US2014051197A1Method for fabricating a vertical light emitting diode (vled) die having epitaxial structure with protective layerSEMILEDS OPTOELECTRONICS CO·Filed 2013·Application pending·0 cites
- 2960US12364079B2Method for making light emitting device (LED) arrays and electronic products using a temporary substrate and a carrier substrateSEMILEDS OPTOELECTRONICS CO·Filed 2022·Granted Jul 15, 2025·0 cites·15 claims
- 3058US10862013B2Light emitting diode device having electrode with low illumination side and high illumination sideSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Dec 8, 2020·0 cites·11 claims
- 3157USD645008SLight emitting diode deviceSEMILEDS OPTOELECTRONICS CO·Filed 2010·Granted Sep 13, 2011·10 cites·1 claims
- 3251US2014191260A1Light emitting semiconductor structureSEMILEDS OPTOELECTRONICS CO·Filed 2014·Application pending·0 cites
- 3350USD695699SElectrodeSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Dec 17, 2013·7 cites·1 claims
- 3450US7892891B2Die separationSEMILEDS OPTOELECTRONICS CO·Filed 2006·Granted Feb 22, 2011·0 cites·21 claims
- 3549US9130114B2Vertical light emitting diode (VLED) dice having confinement layers with roughened surfaces and methods of fabricationSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Sep 8, 2015·0 cites·15 claims
- 3648US8384088B2Vertical light emitting diode having an outwardly disposed electrodeSEMILEDS OPTOELECTRONICS CO·Filed 2010·Granted Feb 26, 2013·0 cites·14 claims
- 3748US2013240834A1Method for fabricating vertical light emitting diode (vled) dice with wavelength conversion layersSEMILEDS OPTOELECTRONICS CO·Filed 2013·Application pending·0 cites
- 3846US2013001510A1Optoelectronic device having current blocking insulation layer for uniform temperature distribution and method of fabricationSEMILEDS OPTOELECTRONICS CO·Filed 2012·Application pending·0 cites
- 3944US2015280078A1White flip chip light emitting diode (fc led) and fabrication methodSEMILEDS OPTOELECTRONICS CO·Filed 2014·Application pending·0 cites
- 4043US9343639B2Light emitting diode (LED) device having lens protective structure and method of fabricationSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted May 17, 2016·0 cites·9 claims
- 4143US9231152B2Light emitting diodeSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Jan 5, 2016·0 cites·5 claims
- 4242US9190589B2Light emitting diodeSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Nov 17, 2015·0 cites·7 claims
- 4342USD715234SFlip chipSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Oct 14, 2014·5 cites·1 claims
- 4442US2013057178A1Light emitting diode (led) system having application specific integrated circuit (asic) and wireless systemSEMILEDS OPTOELECTRONICS CO·Filed 2012·Application pending·0 cites
- 4540US9653435B2Light emitting diode (LED) package having short circuit (VLED) die, lens support dam and same side electrodes and method of fabricationSEMILEDS OPTOELECTRONICS CO·Filed 2015·Granted May 16, 2017·0 cites·13 claims
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