Light emitting semiconductor structure

Abstract

The invention provides a light emitting semiconductor structure, which includes a substrate; a first LED chip formed on the substrate; an adhesion layer formed on the first LED chip; and a second light emitting diode chip formed on the adhesion layer, wherein the second LED chip has a first conductive wire which is electrically connected to the substrate.

1 - 5 . (canceled) 
     
     
         6 . A light emitting semiconductor structure light emitting semiconductor structure, comprising:
 a substrate;   a first LED chip formed on the substrate;   an adhesion layer formed on the first LED chip;   a second LED chip formed on the adhesion layer, wherein the second LED chip has a first conductive wire which is electrically connected to the substrate;   a second adhesion layer formed on the second LED chip; and   a third LED chip formed on the second adhesion layer.   
     
     
         7 . The light emitting semiconductor structure as claimed in  claim 6 , wherein the second LED chip has a third surface contacting the second adhesion layer, the third LED chip has a fourth surface contacting the second adhesion layer, and the third surface is insulated from the fourth surface. 
     
     
         8 . The light emitting semiconductor structure as claimed in  claim 6 , wherein the third LED chip has a third conductive wire which is electrically connected to the substrate. 
     
     
         9 . The light emitting semiconductor structure as claimed in  claim 6 , wherein the first LED chip, the second LED chip and the third LED chip emit three different colors of light. 
     
     
         10 . The light emitting semiconductor structure as claimed in  claim 9 , wherein the three different colors of light comprises blue light, green light and red light. 
     
     
         11 . The light emitting semiconductor structure as claimed in  claim 9 , wherein the three different colors of light comprises blue light, yellow light and red light. 
     
     
         12 . The light emitting semiconductor structure as claimed in  claim 6 , further comprising a phosphor coated on the first LED chip, the second LED chip and the third LED chip. 
     
     
         13 . The light emitting semiconductor structure as claimed in  claim 6 , further comprising a third LED chip formed on the adhesion layer. 
     
     
         14 . The light emitting semiconductor structure as claimed in  claim 13 , wherein the first LED chip has a first surface contacting the adhesion layer, the third LED chip has a fifth surface contacting the contacting the adhesion layer, and the first surface is insulated from the fifth surface. 
     
     
         15 . The light emitting semiconductor structure as claimed in  claim 13 , wherein the third LED chip has a third conductive wire which is electrically connected to the substrate. 
     
     
         16 . The light emitting semiconductor structure as claimed in  claim 13 , wherein the first LED chip, the second LED chip and the third LED chip emit three different colors of light. 
     
     
         17 . The light emitting semiconductor structure as claimed in  claim 16 , wherein the three different colors of light comprises blue light, green light and red light. 
     
     
         18 . The light emitting semiconductor structure as claimed in  claim 16 , wherein the three different colors of light comprises blue light, yellow light and red light. 
     
     
         19 . The light emitting semiconductor structure as claimed in  claim 13 , further comprising a phosphor coated on the first LED chip, the second LED chip and the third LED chip. 
     
     
         20 . The light emitting semiconductor structure as claimed in  claim 6 , further comprising a phosphor coated on the first LED chip and the second LED chip.