Assignee
SHIMIZU NORIYOSHI
JP·4 granted patents·1 pending application·31 citations·filing 2008–2012
Top patents by PatentIndex Score
5 records- 0194US8288875B2Method of manufacturing a semiconductor package and semiconductor package having an electrode pad with a small pitchSHIMIZU NORIYOSHI·Filed 2010·Granted Oct 16, 2012·20 cites·9 claims
- 0283US8581421B2Semiconductor package manufacturing method and semiconductor packageSHIMIZU NORIYOSHI·Filed 2011·Granted Nov 12, 2013·7 cites·17 claims
- 0382US8071474B2Method of manufacturing semiconductor device suitable for forming wiring using damascene methodSHIMIZU NORIYOSHI·Filed 2010·Granted Dec 6, 2011·4 cites·7 claims
- 0457US8067309B2Semiconductor device using metal nitride as insulating film and its manufacture methodSHIMIZU NORIYOSHI·Filed 2008·Granted Nov 29, 2011·0 cites·4 claims
- 0542US2014222230A1Energy management device and programSHIMIZU NORIYOSHI·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →