Assignee
SHIN HEE-BUM
KR·2 granted patents·1 pending application·1 citations·filing 2007–2012
Top patents by PatentIndex Score
3 records- 0152US8549744B2Printed circuit board using bump and method for manufacturing thereofSHIN HEE-BUM·Filed 2007·Granted Oct 8, 2013·1 cites·9 claims
- 0243US8220149B2Method of manufacturing a printed circuit boardSHIN HEE-BUM·Filed 2008·Granted Jul 17, 2012·0 cites·6 claims
- 0342US2012255769A1Printed circuit boardSHIN HEE-BUM·Filed 2012·Application pending·0 cites
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