US2012255769A1PendingUtilityA1
Printed circuit board
Est. expiryFeb 18, 2028(~1.6 yrs left)· nominal 20-yr term from priority
H05K 1/02H05K 3/107H05K 2201/0376Y10T29/49165H05K 3/0023Y10T29/49126H05K 2203/0353H05K 3/423H05K 3/045H05K 2201/09563H05K 1/09H05K 3/426
42
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Claims
Abstract
A printed circuit board including: a first insulation layer; a second insulation layer stacked over the first insulation layer; a circuit pattern and a via land buried in the second insulation layer; and a via penetrating the first insulation layer and integrated with the via land, the via made of a conductive material.
Claims
exact text as granted — not AI-modified1 . A printed circuit board comprising: a first insulation layer; a second insulation layer stacked over the first insulation layer; a circuit pattern and a via land buried in the second insulation layer; and a via penetrating the first insulation layer and integrated with the via land, the via made of a conductive material.
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