Inventor · disambiguated record
Jee-Soo Mok
Also filed as: MOK JEE S · MOK JEE SOO
27 granted patents·43 pending applications·164 citations·filing 2003–2016
95Inventor score
Top patents by PatentIndex Score
70 records- 0193US8058558B2Printed circuit board and manufacturing method thereofMOK JEE-SOO·Filed 2007·Granted Nov 15, 2011·42 cites·5 claims
- 0292US7605459B2Coreless substrate and manufacturing thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted Oct 20, 2009·21 cites·6 claims
- 0391US7653991B2Method for manufacturing printed circuit board having embedded componentSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 2, 2010·22 cites·8 claims
- 0488US9999131B2Printed circuit board with embedded electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 12, 2018·6 cites·11 claims
- 0581US10306778B2Printed circuit board with dam around cavity and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted May 28, 2019·3 cites·20 claims
- 0678US10045444B2Printed circuit board, package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 7, 2018·3 cites·18 claims
- 0778US7435352B2Method of forming solder resist patternSAMSUNG ELECTRO MECH·Filed 2003·Granted Oct 14, 2008·24 cites·19 claims
- 0873US7836590B2Manufacturing method for printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Nov 23, 2010·5 cites·11 claims
- 0970US8198550B2Printed circuit board and method of manufacturing the sameMOK JEE SOO·Filed 2009·Granted Jun 12, 2012·3 cites·6 claims
- 1069US8377748B2Method of manufacturing cooling fin and package substrate with cooling finSAMSUNG ELECTRO MECH·Filed 2011·Granted Feb 19, 2013·2 cites·13 claims
- 1168US8161634B2Method of fabricating a printed circuit boardMOK JEE SOO·Filed 2008·Granted Apr 24, 2012·3 cites·7 claims
- 1268US7279412B2Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2003·Granted Oct 9, 2007·15 cites·11 claims
- 1364US9848492B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 19, 2017·1 cites·4 claims
- 1462US8222534B2Printed circuit board and manufacturing method thereofPARK JUN-HEYOUNG·Filed 2008·Granted Jul 17, 2012·3 cites·3 claims
- 1562US7622329B2Method for fabricating core substrate using paste bumpsSAMSUNG ELECTRO MECH·Filed 2006·Granted Nov 24, 2009·2 cites·4 claims
- 1660US8633396B2Die mounting substrate and method of fabricating the sameLEE EUNG SUEK·Filed 2010·Granted Jan 21, 2014·2 cites·1 claims
- 1755US8592135B2Method of manufacturing printed circuit boardMOK JEE SOO·Filed 2012·Granted Nov 26, 2013·0 cites·7 claims
- 1855US7901985B2Method for manufacturing package on package with cavitySAMSUNG ELECTRO MECH·Filed 2009·Granted Mar 8, 2011·0 cites·6 claims
- 1955US2009250253A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2055US2009229875A1Printed circuit board having fine pattern and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2154US2010230146A1Circuit layer comprising cnts and method of manufacturing the sameLEE EUNG SUEK·Filed 2009·Application pending·0 cites
- 2254US2012222299A1Method of manufacturing a printed circuit boardMOK JEE SOO·Filed 2012·Application pending·0 cites
- 2354US2009301767A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2453US8151446B2Apparatus for manufacturing printed circuit boardMOK JEE-SOO·Filed 2008·Granted Apr 10, 2012·0 cites·2 claims
- 2553US7973248B2Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 5, 2011·0 cites·7 claims
- 2653US7859106B2Multilayer printed circuit board using paste bumpsSAMSUNG ELECTRO MECH·Filed 2009·Granted Dec 28, 2010·0 cites·8 claims
- 2753US2012012379A1Printed circuit boardPARK HO-SIK·Filed 2011·Application pending·0 cites
- 2853US2012030938A1Method of manufacturing printed circuit boardPARK HO-SIK·Filed 2011·Application pending·0 cites
- 2953US2012018195A1Printed circuit boardPARK HO-SIK·Filed 2011·Application pending·0 cites
- 3053US2008308315A1Multilayer printed circuit board and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3153US2009064497A1Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3252US8549744B2Printed circuit board using bump and method for manufacturing thereofSHIN HEE-BUM·Filed 2007·Granted Oct 8, 2013·1 cites·9 claims
- 3352US8298447B2Conductive paste, printed circuit board, and manufacturing method thereofKIM KI-HWAN·Filed 2008·Granted Oct 30, 2012·0 cites·19 claims
- 3452US2012080401A1Method of fabricating multilayer printed circuit boardMOK JEE SOO·Filed 2011·Application pending·0 cites
- 3551US7169707B2Method of manufacturing package substrate with fine circuit pattern using anodic oxidationSAMSUNG ELECTRO MECH·Filed 2004·Granted Jan 30, 2007·6 cites·33 claims
- 3651US2009236131A1Multilayered printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3751US2007059917A1Printed circuit board having fine pattern and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 3850US2009294956A1Cooling fin and package substrate comprising the cooling fin and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3950US2009236130A1Multilayered printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4050US2009250259A1Multilayered printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4150US2007107934A1Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4249US8166647B2Method of manufacturing a printed circuit boardHWANG JUN-OH·Filed 2009·Granted May 1, 2012·0 cites·6 claims
- 4349US7841074B2Method of fabricating paste bump for printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted Nov 30, 2010·0 cites·13 claims
- 4449US2014106510A1Die mounting substrate and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4549US2009308650A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4649US2009294739A1Conductive paste including a carbon nanotube and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4748US2009107709A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4848US2009017275A1Heat-releasing printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4947US2009114425A1Conductive paste and printed circuit board using the sameUNIV SUNGKYUNKWAN·Filed 2008·Application pending·0 cites
- 5047US2009083975A1Method of interconnecting layers of a printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →