Printed circuit board using paste bump and manufacturing method thereof

Abstract

A printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a printed circuit board using paste bumps, comprising: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

1 . A method of manufacturing a printed circuit board using paste bumps, the method comprising: 
 (a) perforating a core board to form at least one via hole;    (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board;    (c) stacking a paste bump board on at least one surface of the core board; and    (d) forming an outer layer circuit on a surface of the paste bump board.    
   
   
       2 . The method of  claim 1 , wherein the core board is a copper clad laminate.  
   
   
       3 . The method of  claim 2 , further comprising an operation of removing the copper foil layer in correspondence with a position where the at least one via hole is to be formed, before the operation (a) of perforating a core board to form at least one via hole.  
   
   
       4 . The method of  claim 2 , further comprising an operation of reducing a thickness of the copper foil layer by half-etching, between the operation (a) of perforating a core board to form at least one via hole and the operation (b) of filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board.  
   
   
       5 . The method of  claim 1 , wherein the at least one via hole is a blind via hole (BVH).  
   
   
       6 . The method of  claim 1 , wherein the paste bump board is formed by 
 (e) printing at least one paste bump on a copper foil;    (f) setting the at least one paste bump; and    (g) stacking an insulation material on the copper foil such that the at least one paste bump penetrates the insulation material.    
   
   
       7 . The method of  claim 6 , wherein a plating layer formed by the fill-plating in the at least one via hole comprises a dimple, and the at least one paste bump is formed in correspondence with a position of the dimple.  
   
   
       8 . The method of  claim 7 , wherein the at least one paste bump has a strength lower than that of the plating layer and a strength greater than that of the insulation material.  
   
   
       9 . The method of  claim 6 , wherein the at least one paste bump includes silver paste.  
   
   
       10 . The method of  claim 1 , further comprising an operation of pressing the paste bump board-onto the core board, between the operation (c) of stacking a paste bump board on at least one surface of the core board and the operation (d) of forming an outer layer circuit on a surface of the paste bump board.  
   
   
       11 . A method of manufacturing a printed circuit board using paste bumps by collectively stacking at least one first core board, at least one second core board, and at least one outer layer board, wherein 
 the first core board is formed by:    (a) forming at least one BVH (blind via hole) on one surface of a core member; and    (b) filling the at least one BVH by fill-plating and forming a circuit pattern on at least one surface of the core member,    the second core board is formed by:    (c) joining at least one core bump onto the other surface of the core member of the first core board in a position where the at least one BVH is formed;    (d) setting the at least one core bump; and    (e) stacking a core insulation material on the other surface of the core member such that the at least one core bump penetrates the core insulation material, and    the outer layer board is formed by:    (f) joining at least one outer layer bump onto a copper foil;    (g) setting the at least one outer layer bump; and    (h) stacking an outer layer insulation material on the copper foil such that the at least one outer layer bump penetrates the outer layer insulation material.    
   
   
       12 . The method of  claim 11 , wherein the core member is a copper clad laminate (CCL).  
   
   
       13 . The method of  claim 12 , further comprising an operation of removing the copper foil layer in correspondence with a position where the at least one BVH is to be formed, before the operation (a) of forming at least one BVH on one surface of a core member.  
   
   
       14 . The method of  claim 12 , further comprising an operation of reducing a thickness of the copper foil layer by half-etching, between the operation (a) of forming at least one BVH on one surface of a core member and the operation (b) of filling the at least one BVH by fill-plating and forming a circuit pattern on at least one surface of the core member.  
   
   
       15 . The method of  claim 11 , wherein the at least one core bump or the at least one outer layer bump is formed by printing silver paste.  
   
   
       16 . The method of  claim 11 , wherein a plating layer formed by the fill-plating in the at least one BVH comprises a dimple, and the at least one core bump or the at least one outer layer bump is formed in correspondence with a position of the dimple.  
   
   
       17 . The method of  claim 16 , wherein the printed circuit board is formed by aligning and stacking a plurality of the first core boards or a plurality of the second core boards such that the at least one core bump or the at least one outer layer bump is in correspondence with a position of the dimple, and afterwards pressing the at least one outer layer board on.  
   
   
       18 . A printed circuit board using paste bumps, the printed circuit board comprising: 
 a core board;    a BVH (blind via hole) formed in the core board;    a plating layer filled in the BVH;    a circuit pattern formed on at least one surface of the core board;    a dimple included in the plating layer; and    a paste bump board stacked on the core board,    wherein the paste bump board is formed by joining at least one paste bump onto a copper foil and stacking an insulation material on the copper foil such that the at least one paste bump penetrates the insulation material.    
   
   
       19 . The printed circuit board of  claim 18 , wherein the core board is a copper clad laminate (CCL).  
   
   
       20 . The printed circuit board of  claim 18 , wherein the at least one paste bump is joined in correspondence with a position of the dimple.  
   
   
       21 . The printed circuit board of  claim 20 , wherein the at least one paste bump is filled in the dimple and electrically connected with the plating layer.  
   
   
       22 . The printed circuit board of  claim 18 , wherein the at least one paste bump has a strength lower than that of the plating layer and a strength greater than that of the insulation material.  
   
   
       23 . The printed circuit board of  claim 18 , further comprising an outer layer circuit formed by removing portions of the copper foil.  
   
   
       24 . The printed circuit board of  claim 18 , further comprising an extra board positioned between the core board and the paste bump board, the extra board comprising: 
 an extra BVH (blind via hole) formed on one surface of the extra board;    an extra plating layer filled in the extra BVH;    an extra circuit pattern formed on at least one surface of the extra board;    an extra dimple included in the extra plating layer; and    an extra bump joined to the other side of the extra board in a position where the extra BVH is formed,    wherein the extra bump is filled in the dimple and electrically connected with the plating layer, and the paste bump is filled in the extra dimple and electrically connected with the extra plating layer.    
   
   
       25 . The printed circuit board of  claim 24 , wherein the paste bump, the extra plating layer, and the plating layer form an all-layer IVH (interstitial via hole).  
   
   
       26 . A method of manufacturing a printed circuit board using paste bumps, the method comprising: 
 (a) perforating a core board to form at least one via hole;    (b) forming an inner layer circuit on at least one surface of the core board;    (c) stacking a paste bump board on at least one surface of the core board; and    (d) forming an outer layer circuit on a surface of the paste bump board.    
   
   
       27 . The method of  claim 26 , wherein the core board is a copper clad laminate (CCL).  
   
   
       28 . The method of  claim 26 , wherein the operation (a) of perforating a core board to form at least one via hole comprises perforating the at least one via hole by mechanical drilling.  
   
   
       29 . The method of  claim 26 , wherein the operation (a) of perforating a core board to form at least one via hole further comprises forming a plating layer on an inner perimeter of the at least one via hole.  
   
   
       30 . The method of  claim 26 , wherein the paste bump board is formed by: 
 (e) printing at least one paste bump on a copper foil in correspondence with a position where the at least one via hole is formed; and    (f) setting the at least one paste bump.    
   
   
       31 . The method of  claim 30 , further comprising an operation of stacking an insulation material on the copper foil such that the at least one paste bump penetrates the insulation material, after the operation (f) of setting the at least one paste bump.  
   
   
       32 . The method of  claim 30 , wherein the at least one paste bump includes silver paste.  
   
   
       33 . The method of  claim 30 , wherein an amount of the at least one paste bump is determined in correspondence with a size of the at least one via hole such that the at least one via hole is filled.  
   
   
       34 . The method of  claim 30 , wherein the at least one paste bump has a strength lower than that of the plating layer and a strength greater than that of the insulation material.  
   
   
       35 . The method of  claim 30 , wherein the at least one paste bump is formed in a shape of a BVH (blind via hole) configured to electrically connect the inner layer circuit and the outer layer circuit.  
   
   
       36 . The method of  claim 26 , wherein the operation (c) of stacking a paste bump board on at least one surface of the core board comprises an operation of stacking the paste bump board on both surfaces of the core board.  
   
   
       37 . The method of  claim 36 , further comprising an operation of pressing the paste bump board on both surfaces of the core board, between the operation (c) of stacking a paste bump board on at least one surface of the core board and the operation (d) of forming an outer layer circuit on a surface of the paste bump board.  
   
   
       38 . A printed circuit board using paste bumps, the printed circuit board comprising: 
 a core board;    a via hole formed by perforating a portion of the core board;    an inner layer circuit formed on at least one surface of the core board;    a paste bump board, formed by joining at least one paste bump onto a copper foil layer and stacking an insulation material, and stacked on a surface of the core board; and    an outer layer circuit formed on a surface of the paste bump board,    wherein the at least one paste bump is joined in correspondence with a position of the via hole, and the via hole is filled by the at least one paste bump.    
   
   
       39 . The printed circuit board of  claim 38 , wherein the core board is a copper clad laminate (CCL).  
   
   
       40 . The printed circuit board of  claim 38 , wherein a plating layer is formed on an inner perimeter of the via hole.  
   
   
       41 . The printed circuit board of  claim 40 , wherein the plating layer has varying thickness along its depth from an opening of the via hole such that the via hole is formed in a shape corresponding with a shape of the at least one paste bump.  
   
   
       42 . The printed circuit board of  claim 40 , wherein a thickness of the plating layer increases along its depth from an opening of the via hole.  
   
   
       43 . The printed circuit board of  claim 38 , wherein the paste bump board is formed by printing at least one paste bump on a copper foil, setting the at least one paste bump, and afterwards stacking an insulation material on the copper foil such that the at least one paste bump penetrates the insulation material.  
   
   
       44 . The printed circuit board of  claim 38 , wherein the at least one paste bump includes silver paste.  
   
   
       45 . The printed circuit board of  claim 38 , wherein an amount of the at least one paste bump is determined in correspondence with a size of the via hole.  
   
   
       46 . The printed circuit board of  claim 38 , wherein the at least one paste bump has a strength lower than that of the plating layer and a strength greater than that of the insulation material.  
   
   
       47 . The printed circuit board of  claim 38 , wherein the at least one paste bump is formed in a shape of a BVH (blind via hole) configured to electrically connect the inner layer circuit and the outer layer circuit.  
   
   
       48 . The printed circuit board of  claim 38 , wherein the paste bump board is stacked on both surfaces of the core board.