Inventor · disambiguated record
Byung-Bae Seo
Also filed as: SEO BYUNG-BAE
4 granted patents·4 pending applications·4 citations·filing 2006–2011
63Inventor score
Top patents by PatentIndex Score
8 records- 0162US7622329B2Method for fabricating core substrate using paste bumpsSAMSUNG ELECTRO MECH·Filed 2006·Granted Nov 24, 2009·2 cites·4 claims
- 0257US8535547B2Printed circuit board manufacturing system and manufacturing method thereofCHO CHUNG-WOO·Filed 2008·Granted Sep 17, 2013·2 cites·2 claims
- 0353US7973248B2Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 5, 2011·0 cites·7 claims
- 0453US7859106B2Multilayer printed circuit board using paste bumpsSAMSUNG ELECTRO MECH·Filed 2009·Granted Dec 28, 2010·0 cites·8 claims
- 0553US2009064497A1Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0650US2007107934A1Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 0747US2011138616A1Printed circuit board manufacturing systemSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 0837US2012168220A1Multi-layer printed circuit board and method of manufacturing the sameLEE HAN UL·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →