Printed circuit board using paste bump and manufacturing method thereof

Abstract

The method of manufacturing a printed circuit board using paste bumps includes perforating a core board to form at least one via hole, filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, stacking a paste bump board on at least one surface of the core board, and forming an outer layer circuit on a surface of the paste bump board. The method provides a structurally stable all-layer IVH structure due to increased strength in the BVH's of the plated core boards and the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

1 . A method of manufacturing a printed circuit board using paste bumps, comprising:
 perforating a core board to form at least one via hole;   filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board;   stacking a paste bump board on at least one surface of the core board; and   forming an outer layer circuit on a surface of the paste bump board.   
   
   
       2 . The method of  claim 1 , wherein the core board is a copper clad laminate. 
   
   
       3 . The method of  claim 2 , further comprising removing the copper foil layer in correspondence with a position where the at least one via hole is to be formed, before perforating the core board to form at least one via hole. 
   
   
       4 . The method of  claim 2 , further comprising reducing a thickness of the copper foil layer by half-etching, between perforating the core board to form at least one via hole and filling the at least one via hole by fill-plating and forming the circuit pattern on at least one surface of the core board. 
   
   
       5 . The method of  claim 1 , wherein the at least one via hole is a blind via hole (BVH). 
   
   
       6 . The method of  claim 1 , wherein forming the paste bump board comprises:
 printing at least one paste bump on a copper foil;   setting the at least one paste bump; and   stacking an insulation material on the copper foil such that the at least one paste bump penetrates the insulation material.   
   
   
       7 . The method of  claim 6 , wherein a plating layer formed by the fill-plating in the at least one via hole comprises a dimple, and the at least one paste bump is formed in correspondence with a position of the dimple. 
   
   
       8 . The method of  claim 7 , wherein the at least one paste bump has a strength lower than that of the plating layer and a strength greater than that of the insulation material. 
   
   
       9 . The method of  claim 6 , wherein the at least one paste bump includes silver paste. 
   
   
       10 . The method of  claim 1 , further comprising pressing the paste bump board onto the core board, between stacking the paste bump board on at least one surface of the core board and forming the outer layer circuit on the surface of the paste bump board. 
   
   
       11 . A method of manufacturing a printed circuit board using paste bumps by collectively stacking at least one first core board, at least one second core board, and at least one outer layer board,
 wherein forming the first core board comprises:   forming at least one BVH (blind via hole) on one surface of a core member; and   filling the at least one BVH by fill-plating and forming a circuit pattern on at least one surface of the core member,   forming the second core board comprises   joining at least one core bump onto the other surface of the core member of the first core board in a position where the at least one BVH is formed;   setting the at least one core bump; and   stacking a core insulation material on the other surface of the core member such that the at least one core bump penetrates the core insulation material, and   forming the outer layer comprises   joining at least one outer layer bump onto a copper foil;   setting the at least one outer layer bump; and   stacking an outer layer insulation material on the copper foil such that the at least one outer layer bump penetrates the outer layer insulation material.   
   
   
       12 . The method of  claim 11 , wherein the core member is a copper clad laminate (CCL). 
   
   
       13 . The method of  claim 12 , further comprising removing the copper foil layer in correspondence with a position where the at least one BVH is to be formed, before forming at least one BVH on one surface of the core member. 
   
   
       14 . The method of  claim 12 , further comprising reducing a thickness of the copper foil layer by half-etching, between forming at least one BVH on one surface of the core member and filling the at least one BVH by fill-plating and forming the circuit pattern on at least one surface of the core member. 
   
   
       15 . The method of  claim 11  wherein the at least one core bump or the at least one outer layer bump is formed by printing silver paste. 
   
   
       16 . The method of  claim 11 , wherein a plating layer formed by the fill-plating in the at least one BVH comprises a dimple, and the at least one core bump or the at least one outer layer bump is formed in correspondence with a position of the dimple. 
   
   
       17 . The method of  claim 16 , wherein the printed circuit board is formed by aligning and stacking a plurality of the first core boards or a plurality of the second core boards such that the at least one core bump or the at least one outer layer bump is in correspondence with a position of the dimple, and afterwards pressing the at least one outer layer board on. 
   
   
       18 . A method of manufacturing a printed circuit board using paste bumps, the method comprising:
 perforating a core board to form at least one via hole;   forming an inner layer circuit on at least one surface of the core board;   stacking a paste bump board on at least one surface of the core board; and   forming an outer layer circuit on a surface of the paste bump board.   
   
   
       19 . The method of  claim 18 , wherein the core board is a copper clad laminate (CCL). 
   
   
       20 . The method of  claim 18 , wherein perforating the core board to form at least one via hole comprises perforating the at least one via hole by mechanical drilling. 
   
   
       21 . The method of  claim 18 , wherein perforating the core board to form at least one via hole further comprises forming a plating layer on an inner perimeter of the at least one via hole. 
   
   
       22 . The method of  claim 18 , wherein forming the paste bump board comprises:
 printing at least one paste bump on a copper foil in correspondence with a position where the at least one via hole is formed; and   setting the at least one paste bump.   
   
   
       23 . The method of  claim 22 , further comprising an operation of stacking an insulation material on the copper foil such that the at least one paste bump penetrates the insulation material, after setting the at least one paste bump. 
   
   
       24 . The method of  claim 22 , wherein the at least one paste bump includes silver paste. 
   
   
       25 . The method of  claim 22 , wherein an amount of the at least one paste bump is determined in correspondence with a size of the at least one via hole such that the at least one via hole is filled. 
   
   
       26 . The method of  claim 22 , wherein the at least one paste bump has a strength lower than that of the plating layer and a strength greater than that of the insulation material. 
   
   
       27 . The method of  claim 22 , wherein the at least one paste bump is formed in a shape of a BVH (blind via hole) configured to electrically connect the inner layer circuit and the outer layer circuit. 
   
   
       28 . The method of  claim 18 , wherein stacking the paste bump board on at least one surface of the core board comprises stacking the paste bump board on both surfaces of the core board. 
   
   
       29 . The method of  claim 28 , further comprising pressing the paste bump board on both surfaces of the core board, between stacking the paste bump board on at least one surface of the core board and forming the outer layer circuit on the surface of the paste bump board.