Inventor · disambiguated record
Yoong Oh
Also filed as: OH YOONG · OH YOONG SIANG
13 granted patents·16 pending applications·20 citations·filing 2004–2023
86Inventor score
Top patents by PatentIndex Score
29 records- 0190US10849225B1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 24, 2020·3 cites·12 claims
- 0284US9736927B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 15, 2017·4 cites·9 claims
- 0380US9736939B2Printed circuit board and method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 15, 2017·3 cites·19 claims
- 0475US12224235B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2023·Granted Feb 11, 2025·0 cites·18 claims
- 0575US10991647B2Printed circuit board and package structure having the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Apr 27, 2021·2 cites·21 claims
- 0667US11297714B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2020·Granted Apr 5, 2022·0 cites·16 claims
- 0762US7622329B2Method for fabricating core substrate using paste bumpsSAMSUNG ELECTRO MECH·Filed 2006·Granted Nov 24, 2009·2 cites·4 claims
- 0859US2022181245A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2021·Application pending·0 cites
- 0953US8151446B2Apparatus for manufacturing printed circuit boardMOK JEE-SOO·Filed 2008·Granted Apr 10, 2012·0 cites·2 claims
- 1053US7973248B2Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 5, 2011·0 cites·7 claims
- 1153US7859106B2Multilayer printed circuit board using paste bumpsSAMSUNG ELECTRO MECH·Filed 2009·Granted Dec 28, 2010·0 cites·8 claims
- 1253US2009064497A1Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1351US7169707B2Method of manufacturing package substrate with fine circuit pattern using anodic oxidationSAMSUNG ELECTRO MECH·Filed 2004·Granted Jan 30, 2007·6 cites·33 claims
- 1450US2015129289A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1550US2007107934A1Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1646US2014102766A1Multi-layer type coreless substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1746US2014014398A1Coreless subtrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1845US2011132546A1Apparatus for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1944US11088089B2Package substrateSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 10, 2021·0 cites·20 claims
- 2043US2014102767A1Multi-layer type printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2142US2014027156A1Multilayer type coreless substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2241US9060458B2Method for manufacturing multi-layer printed circuit boardOH YOONG·Filed 2011·Granted Jun 16, 2015·0 cites·7 claims
- 2341US2020260580A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2019·Application pending·0 cites
- 2439US2014317235A1Method, System and Program Product for Transmitting Software and Information ServicesOH YOONG SIANG·Filed 2013·Application pending·0 cites
- 2538US2012034386A1Apparatus and method for coatingOH YOONG·Filed 2011·Application pending·0 cites
- 2636US2015373841A1Core and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2734US2016128186A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2833US2012103662A1Printed circuit board and manufacturing method thereofLEE CHANG BO·Filed 2011·Application pending·0 cites
- 2930US2012119358A1Semicondiuctor package substrate and method for manufacturing the sameOH YOONG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →