Inventor · disambiguated record
Chang-Sup Ryu
Also filed as: RYU CHANG S · RYU CHANG SUP
43 granted patents·65 pending applications·389 citations·filing 2003–2015
97Inventor score
Top patents by PatentIndex Score
108 records- 0198US7282394B2Printed circuit board including embedded chips and method of fabricating the same using platingSAMSUNG ELECTRO MECH·Filed 2005·Granted Oct 16, 2007·114 cites·6 claims
- 0294US7277005B2Printed circuit board including embedded resistor and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2004·Granted Oct 2, 2007·34 cites·12 claims
- 0393US7564116B2Printed circuit board with embedded capacitors therein and manufacturing process thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 21, 2009·33 cites·10 claims
- 0492US7605459B2Coreless substrate and manufacturing thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted Oct 20, 2009·21 cites·6 claims
- 0590US7707715B2Method of fabricating multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted May 4, 2010·18 cites·21 claims
- 0690US7350296B2Method of fabricating a printed circuit board including an embedded passive componentSAMSUNG ELECTRO MECH·Filed 2004·Granted Apr 1, 2008·41 cites·8 claims
- 0789US7583512B2Printed circuit board including embedded passive componentSAMSUNG ELECTRO MECH·Filed 2008·Granted Sep 1, 2009·14 cites·6 claims
- 0886US7485569B2Printed circuit board including embedded chips and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Feb 3, 2009·13 cites·10 claims
- 0983US7351915B2Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2004·Granted Apr 1, 2008·31 cites·8 claims
- 1079US9040838B2Method for forming solder resist and substrate for packageSAMSUNG ELECTRO MECH·Filed 2013·Granted May 26, 2015·6 cites·6 claims
- 1179US7550316B2Board on chip package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted Jun 23, 2009·5 cites·6 claims
- 1278US7378326B2Printed circuit board with embedded capacitors therein and manufacturing process thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted May 27, 2008·9 cites·18 claims
- 1377US8432706B2Printed circuit board and electro applicationKIM HAN·Filed 2009·Granted Apr 30, 2013·6 cites·3 claims
- 1474US8981549B2Multi chip packageKIM HYE JIN·Filed 2011·Granted Mar 17, 2015·4 cites·9 claims
- 1570US8780584B2Printed circuit board and electro applicationSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 15, 2014·2 cites·3 claims
- 1670US8198550B2Printed circuit board and method of manufacturing the sameMOK JEE SOO·Filed 2009·Granted Jun 12, 2012·3 cites·6 claims
- 1770US7506437B2Printed circuit board having chip package mounted thereon and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Mar 24, 2009·3 cites·5 claims
- 1869US8377748B2Method of manufacturing cooling fin and package substrate with cooling finSAMSUNG ELECTRO MECH·Filed 2011·Granted Feb 19, 2013·2 cites·13 claims
- 1968US8966746B2Method of fabricating cavity capacitor embedded in printed circuit boardKIM HAN·Filed 2011·Granted Mar 3, 2015·2 cites·5 claims
- 2068US8039174B2Flexible fuel cellSAMSUNG ELECTRO MECH·Filed 2006·Granted Oct 18, 2011·2 cites·7 claims
- 2166US8181339B2Method of manufacturing a printed circuit boardKIM JOON-SUNG·Filed 2008·Granted May 22, 2012·2 cites·12 claims
- 2266US8022553B2Mounting substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Sep 20, 2011·3 cites·1 claims
- 2365US7983055B2Printed circuit board with embedded cavity capacitorSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 19, 2011·2 cites·15 claims
- 2462US8232478B2Electromagnetic interference noise reduction board using electromagnetic bandgap structureKIM HAN·Filed 2009·Granted Jul 31, 2012·1 cites·21 claims
- 2562US7622329B2Method for fabricating core substrate using paste bumpsSAMSUNG ELECTRO MECH·Filed 2006·Granted Nov 24, 2009·2 cites·4 claims
- 2662US2009130390A1Optical wiring board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2761US8169790B2Electromagnetic bandgap structure and printed circuit boardKIM HAN·Filed 2008·Granted May 1, 2012·1 cites·21 claims
- 2858US7943864B2Printed circuit board having electromagnetic bandgap structureSAMSUNG ELECTRO MECH·Filed 2008·Granted May 17, 2011·1 cites·9 claims
- 2958US7394249B2Printed circuit board with weak magnetic field sensorSAMSUNG ELECTRO MECH·Filed 2004·Granted Jul 1, 2008·7 cites·9 claims
- 3057US8499444B2Method of manufacturing a package substrateAN JIN-YONG·Filed 2008·Granted Aug 6, 2013·1 cites·8 claims
- 3157US8003439B2Board on chip package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Granted Aug 23, 2011·0 cites·5 claims
- 3256US2009152233A1Printed circuit board having chip package mounted thereon and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3356US2010024212A1Method of fabricating multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3455US8592135B2Method of manufacturing printed circuit boardMOK JEE SOO·Filed 2012·Granted Nov 26, 2013·0 cites·7 claims
- 3555US7901985B2Method for manufacturing package on package with cavitySAMSUNG ELECTRO MECH·Filed 2009·Granted Mar 8, 2011·0 cites·6 claims
- 3655US2009229875A1Printed circuit board having fine pattern and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3754US2010230146A1Circuit layer comprising cnts and method of manufacturing the sameLEE EUNG SUEK·Filed 2009·Application pending·0 cites
- 3854US2009184420A1Post bump and method of forming the sameSAMSUNG ELECTROMECHANICS CO LT·Filed 2008·Application pending·0 cites
- 3954US2012222299A1Method of manufacturing a printed circuit boardMOK JEE SOO·Filed 2012·Application pending·0 cites
- 4054US2009301767A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4154US2009294164A1Printed circuit board including landless via and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4254US2012199388A1Printed circuit board and manufacturing method thereofKIM JOON-SUNG·Filed 2012·Application pending·0 cites
- 4353US8151446B2Apparatus for manufacturing printed circuit boardMOK JEE-SOO·Filed 2008·Granted Apr 10, 2012·0 cites·2 claims
- 4453US7973248B2Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 5, 2011·0 cites·7 claims
- 4553US7859106B2Multilayer printed circuit board using paste bumpsSAMSUNG ELECTRO MECH·Filed 2009·Granted Dec 28, 2010·0 cites·8 claims
- 4653US2011061907A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 4753US2012066902A1Method of manufacturing printed circuit board including landless viaKIM HAN·Filed 2011·Application pending·0 cites
- 4853US2009064497A1Printed circuit board using paste bump and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4951US2008314621A1Parallel chip embedded printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 5051US2011079349A1Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
Showing the top 50 of 108 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →