Method of manufacturing a printed circuit board

Abstract

A printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The printed circuit board is made slim, and reliability and the degree of design freedom are increased.

1 . A method of manufacturing a printed circuit board, comprising:
 forming at least one circuit layer on a semi-cured insulating layer, the circuit layer having a connection pad;   forming insulating materials on the insulating layer, the insulating materials having an opening through which the connection pad is exposed; and   pressing and embedding the circuit layer and the insulating materials into the insulating layer.   
     
     
         2 . The method according to  claim 1 , wherein forming the at least one circuit layer comprises:
 printing a first metal layer with a bump;   applying a semi-cured insulating layer on the first metal layer printed with the bump; and   applying a second metal layer on the insulating layer and patterning the first and second metal layers to form first and second circuit layers each having a connection pad.   
     
     
         3 . The method according to  claim 1 , wherein, in pressing and embedding the circuit layer and the insulating materials, one side of the connection pad, which is flush with the insulating layer, acts as an exposed surface to which an external terminal is bonded. 
     
     
         4 . The method according to  claim 1 , wherein the insulating materials are flush at one side with the insulating layer and are embedded at the other side in the insulating layer. 
     
     
         5 . The method according to  claim 4 , wherein the at least one circuit layer is formed on the other side of the insulating materials and is embedded in the insulating layer. 
     
     
         6 . The method according to  claim 4 , wherein the at least one circuit layer is embedded in the insulating materials. 
     
     
         7 . The method according to  claim 1 , wherein, in pressing and embedding the circuit layer and the insulating materials, the pressing is executed while the insulating layer is in a semi-cured state. 
     
     
         8 . The method according to  claim 1 , wherein the insulating materials are made of photosensitive insulating material. 
     
     
         9 . The method according to  claim 8 , wherein forming the insulating materials comprise:
 applying a photosensitive insulating material on the insulating layer; and   subjecting the photosensitive insulating material to exposure and development processes to form an opening through which the connection pad is exposed.