US2012199388A1PendingUtilityA1
Printed circuit board and manufacturing method thereof
Est. expiryJan 3, 2028(~1.5 yrs left)· nominal 20-yr term from priority
H05K 3/22H05K 2203/1536H05K 3/007H05K 2203/1394Y10T29/49155H05K 2201/0394Y10T29/49165H05K 3/108H05K 3/06Y10T29/49126H05K 2201/09736H05K 1/0265H05K 2203/1476Y10T29/4913H05K 2203/0156H05K 2201/0352H05K 3/427
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Claims
Abstract
A printed circuit board including: an insulation layer; a first circuit pattern formed over one surface of the insulation layer, the first circuit pattern having a side thereof slanted with respect to the insulation layer; and a second circuit pattern formed over the other surface of the insulation layer, the second circuit pattern having a side thereof slanted with respect to the insulation layer, wherein the side of the second circuit pattern is less slanted than the side of the first circuit pattern.
Claims
exact text as granted — not AI-modified1 . A printed circuit board comprising:
an insulation layer; a first circuit pattern formed over one surface of the insulation layer, the first circuit pattern having a side thereof slanted with respect to the insulation layer; and a second circuit pattern formed over the other surface of the insulation layer, the second circuit pattern having a side thereof slanted with respect to the insulation layer, wherein the side of the second circuit pattern is less slanted than the side of the first circuit pattern.
2 . The printed circuit board of claim 1 , wherein an interface is formed within the first circuit pattern.Cited by (0)
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