Inventor · disambiguated record
Joon-Sung Kim
Also filed as: KIM JOON · KIM JOON S · KIM JOON-SUNG
59 granted patents·33 pending applications·235 citations·filing 1994–2025
98Inventor score
Files withSAMSUNG ELECTRO MECH32SAMSUNG ELECTRONICS CO LTD26KIM SANG HOON7KIM JOON-SUNG5SAMSUNG SDI CO LTD4
Top patents by PatentIndex Score
92 records- 0192US8159824B2Printed circuit boardCHO HAN-SEO·Filed 2008·Granted Apr 17, 2012·51 cites·4 claims
- 0290US7529439B2Optical printed circuit board and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted May 5, 2009·22 cites·7 claims
- 0388US9580552B2Polyamide ester resin, method for preparing the same, and molded article including the sameSAMSUNG SDI CO LTD·Filed 2015·Granted Feb 28, 2017·3 cites·11 claims
- 0488US7831116B2Optical waveguide and optical printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Nov 9, 2010·16 cites·22 claims
- 0586US9042113B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Granted May 26, 2015·6 cites·5 claims
- 0686US8426299B2Method of manufacturing semiconductor deviceKIM JOON-SUNG·Filed 2011·Granted Apr 23, 2013·10 cites·20 claims
- 0785US10825934B2Vertical semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 3, 2020·2 cites·20 claims
- 0885US9837343B2Chip embedded substrateSAMSUNG ELECTRO MECH·Filed 2015·Granted Dec 5, 2017·5 cites·5 claims
- 0984US8265445B2Printed circuit board for optical waveguide and method of manufacturing the sameKIM JOON SUNG·Filed 2012·Granted Sep 11, 2012·6 cites·14 claims
- 1084US7489839B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted Feb 10, 2009·9 cites·7 claims
- 1183US9349821B2Electrode structure, method of fabricating the same, and semiconductor device including the electrode structureLEE DONG-KAK·Filed 2015·Granted May 24, 2016·3 cites·14 claims
- 1282US7991250B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2010·Granted Aug 2, 2011·5 cites·11 claims
- 1378US7809220B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Oct 5, 2010·7 cites·10 claims
- 1477US2024397719A1Semiconductor memory devices and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1576US10529865B2Vertical semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 7, 2020·2 cites·20 claims
- 1674US12058863B2Semiconductor memory devices and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·15 claims
- 1774US8065797B2Fabricating method for printed circuit boardWATANABE RYOICHI·Filed 2007·Granted Nov 29, 2011·8 cites·10 claims
- 1873US10616898B2Apparatus and method for mitigating interference in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 7, 2020·2 cites·20 claims
- 1972US7672547B2Printed circuit board including optical waveguide and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Mar 2, 2010·5 cites·16 claims
- 2070US8368488B2Electromagnetic bandgap structure and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 5, 2013·3 cites·30 claims
- 2169US8761551B2Optical flexible printed circuit board with optical waveguides and method manufacturing the sameKIM SANG HOON·Filed 2010·Granted Jun 24, 2014·2 cites·18 claims
- 2268US10622273B2Semiconductor package with improved flatness of an insulating layer formed on patternsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 14, 2020·1 cites·11 claims
- 2368US8710943B2Electromagnetic bandgap structure and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 29, 2014·1 cites·20 claims
- 2468US8457450B2Printed circuit board and manufacturing method thereofKIM SANG-HOON·Filed 2008·Granted Jun 4, 2013·2 cites·14 claims
- 2568US8056220B2Printed circuit board and manufacturing method thereofKIM SANG-HOON·Filed 2008·Granted Nov 15, 2011·3 cites·6 claims
- 2666US11778821B2Semiconductor memory devices and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 3, 2023·0 cites·20 claims
- 2766US8181339B2Method of manufacturing a printed circuit boardKIM JOON-SUNG·Filed 2008·Granted May 22, 2012·2 cites·12 claims
- 2866US8160417B2Printed circuit board for optical waveguide and method of manufacturing the sameKIM JOON SUNG·Filed 2008·Granted Apr 17, 2012·2 cites·8 claims
- 2965US6573139B2Method of fabricating cell of flash memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jun 3, 2003·10 cites·19 claims
- 3064US9902808B2Copolymerized polyamide resin, method for preparing the same and molded article comprising the sameSAMSUNG SDI CO LTD·Filed 2014·Granted Feb 27, 2018·0 cites·13 claims
- 3164US9177793B2Methods of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 3, 2015·1 cites·19 claims
- 3263US9202813B2Electrode structure, method of fabricating the same, and semiconductor device including the electrode structureLEE DONG-KAK·Filed 2011·Granted Dec 1, 2015·1 cites·16 claims
- 3363US8369676B2Printed circuit board for optical waveguide and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Granted Feb 5, 2013·2 cites·8 claims
- 3463US2018127545A1Copolymerized Polyamide Resin, Method for Preparing the Same and Molded Article Comprising the SameLOTTE ADVANCED MAT CO LTD·Filed 2018·Application pending·0 cites
- 3562US10966202B2Wireless communication device including memory de-allocator for efficient memory usage and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·20 claims
- 3662US2009130390A1Optical wiring board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3761US10685959B2Electrode structure, method of fabricating the same, and semiconductor device including the electrode structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 16, 2020·0 cites·20 claims
- 3860US8883596B2Semiconductor device with vertical channel transistor and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 11, 2014·2 cites·14 claims
- 3960US7697800B2Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Granted Apr 13, 2010·1 cites·3 claims
- 4059US8419853B2Stacked semiconductor device and related methodKANG YUN-SEUNG·Filed 2009·Granted Apr 16, 2013·1 cites·12 claims
- 4159US8048324B2Method of manufacturing optical waveguide and method of manufacturing package boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Nov 1, 2011·1 cites·11 claims
- 4258US12396173B2Semiconductor memory device, method for fabricating the same and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 4358US10833124B2Semiconductor devices including data storage patternsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 10, 2020·1 cites·12 claims
- 4457US7049197B2Method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 23, 2006·7 cites·19 claims
- 4556US10524264B2Wireless communication device including memory de-allocator for efficient memory usage and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 31, 2019·0 cites·20 claims
- 4656US7602072B2Substrate having alignment marks and method of obtaining alignment information using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 13, 2009·1 cites·13 claims
- 4756US5591675AInterconnecting method for semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Jan 7, 1997·24 cites·4 claims
- 4855US2008176374A1Methods of forming semiconductor devices using self-aligned metal shuntsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 4954US9315627B2Polyamide ester resin, method of preparing the same, and molded article including the sameCHEIL IND INC·Filed 2013·Granted Apr 19, 2016·0 cites·12 claims
- 5054US2012199388A1Printed circuit board and manufacturing method thereofKIM JOON-SUNG·Filed 2012·Application pending·0 cites
Showing the top 50 of 92 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →