Printed circuit board manufacturing system

Abstract

A printed circuit board manufacturing system that uses a substrate that includes a pad and an insulation layer covering the pad. The system includes an image sensor part acquiring an image of the substrate, a control part generating a control signal to form a via hole, and a laser applying part applying a laser, considering the control signal, to the part of the insulation layer that corresponds to the location information of the pad.

1 . A printed circuit board manufacturing system, using a substrate that comprises a pad and an insulation layer covering the pad, comprising:
 an image sensor part to acquire an image of the substrate;   a control part to generate a control signal to form a via hole; and   a laser applying part to apply a laser, considering the control signal, to a part of the insulation layer that corresponds to location information of the pad.   
     
     
         2 . The printed circuit board manufacturing system of  claim 1 , wherein the control part extracts a center coordinate of an area that corresponds to the pad in the image of the substrate.