Inventor · disambiguated record
Ki Young Yoo
Also filed as: YOO KI YOUNG
3 granted patents·10 pending applications·4 citations·filing 2008–2023
57Inventor score
Top patents by PatentIndex Score
13 records- 0177US11107621B2Coil component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 31, 2021·1 cites·13 claims
- 0275US11056274B2Thin film type inductorSAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 6, 2021·1 cites·19 claims
- 0363US2024212918A1Coil componentSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0460US2024029945A1Coil componentSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0557US8535547B2Printed circuit board manufacturing system and manufacturing method thereofCHO CHUNG-WOO·Filed 2008·Granted Sep 17, 2013·2 cites·2 claims
- 0652US2023178281A1Coil componentSAMSUNG ELECTRO MECH·Filed 2022·Application pending·0 cites
- 0747US2011138616A1Printed circuit board manufacturing systemSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 0846US2009027864A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0946US2014102766A1Multi-layer type coreless substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1043US2009205854A1Printed circuit board for a package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1143US2015075845A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1243US2014102767A1Multi-layer type printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1342US2014027156A1Multilayer type coreless substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →