Assignee
SHINKO ELECTRIC IND CO
JP·1,425 granted patents·389 pending applications·16,604 citations·filing 1979–2025
Top patents by PatentIndex Score
1,814 records- 0199US9818681B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Nov 14, 2017·127 cites·9 claims
- 0299US7709932B2Semiconductor wafer having a separation portion on a peripheral areaSHINKO ELECTRIC IND CO·Filed 2005·Granted May 4, 2010·270 cites·1 claims
- 0398US7847417B2Flip-chip mounting substrate and flip-chip mounting methodSHINKO ELECTRIC IND CO·Filed 2006·Granted Dec 7, 2010·80 cites·6 claims
- 0498US6703310B2Semiconductor device and method of production of sameSHINKO ELECTRIC IND CO·Filed 2002·Granted Mar 9, 2004·211 cites·7 claims
- 0598US6590291B2Semiconductor device and manufacturing method thereforSHINKO ELECTRIC IND CO·Filed 2001·Granted Jul 8, 2003·197 cites·5 claims
- 0698US6418615B1Method of making multilayered substrate for semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2000·Granted Jul 16, 2002·164 cites·21 claims
- 0798US5834844ASemiconductor device having an element with circuit pattern thereonSHINKO ELECTRIC IND CO·Filed 1996·Granted Nov 10, 1998·525 cites·10 claims
- 0897US9875957B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2015·Granted Jan 23, 2018·27 cites·8 claims
- 0997US8941230B2Semiconductor package and manufacturing methodSHINKO ELECTRIC IND CO·Filed 2013·Granted Jan 27, 2015·79 cites·5 claims
- 1097US8379400B2Interposer mounted wiring board and electronic component deviceSHINKO ELECTRIC IND CO·Filed 2010·Granted Feb 19, 2013·48 cites·7 claims
- 1197US8023248B2Electrostatic chuckSHINKO ELECTRIC IND CO·Filed 2010·Granted Sep 20, 2011·155 cites·6 claims
- 1297US7989707B2Chip embedded substrate and method of producing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 2, 2011·71 cites·12 claims
- 1397US7531011B2Method of manufacturing capacitor deviceSHINKO ELECTRIC IND CO·Filed 2005·Granted May 12, 2009·68 cites·8 claims
- 1497US7456497B2Electronic devices and its production methodsSHINKO ELECTRIC IND CO·Filed 2003·Granted Nov 25, 2008·118 cites·6 claims
- 1597US7388293B2Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructionsSHINKO ELECTRIC IND CO·Filed 2005·Granted Jun 17, 2008·64 cites·10 claims
- 1697US7279771B2Wiring board mounting a capacitorSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 9, 2007·86 cites·5 claims
- 1797US7222421B2Circuit substrate manufacturing methodSHINKO ELECTRIC IND CO·Filed 2005·Granted May 29, 2007·47 cites·4 claims
- 1897US6472745B1Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2000·Granted Oct 29, 2002·232 cites·19 claims
- 1997US6441314B2Multilayered substrate for semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2001·Granted Aug 27, 2002·80 cites·13 claims
- 2096US11892239B2Loop-type heat pipe including an evaporator, first and second condensers, a liquid pipe connecting the evaporator to the first and second condensers, and first and second vapor pipes connecting the evaporator to the first and second condensersSHINKO ELECTRIC IND CO·Filed 2021·Granted Feb 6, 2024·3 cites·7 claims
- 2196US9831158B2Lead frame and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Nov 28, 2017·17 cites·26 claims
- 2296US7723838B2Package structure having semiconductor device embedded within wiring boardSHINKO ELECTRIC IND CO·Filed 2005·Granted May 25, 2010·87 cites·7 claims
- 2396US7659021B2Power generating apparatus using solid oxide fuel cellSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 9, 2010·33 cites·18 claims
- 2496US7656023B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 2, 2010·37 cites·4 claims
- 2596US7169501B2Fuel cellSHINKO ELECTRIC IND CO·Filed 2003·Granted Jan 30, 2007·105 cites·2 claims
- 2696US7122901B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 17, 2006·54 cites·7 claims
- 2796US6699787B2Semiconductor device and method of production of sameSHINKO ELECTRIC IND CO·Filed 2002·Granted Mar 2, 2004·119 cites·12 claims
- 2896US6121688AAnisotropic conductive sheet and printed circuit boardSHINKO ELECTRIC IND CO·Filed 1998·Granted Sep 19, 2000·107 cites·8 claims
- 2995US10352626B2Heat pipeSHINKO ELECTRIC IND CO·Filed 2017·Granted Jul 16, 2019·6 cites·14 claims
- 3095US9859201B2Wiring substrate, semiconductor device, and method for manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Jan 2, 2018·18 cites·9 claims
- 3195US7782624B2Electronic apparatusSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 24, 2010·35 cites·8 claims
- 3295US7772118B2Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 10, 2010·32 cites·20 claims
- 3395US7678685B2Interposer and method for producing the same and electronic deviceSHINKO ELECTRIC IND CO·Filed 2008·Granted Mar 16, 2010·33 cites·7 claims
- 3495US7605463B2Interposer and method for producing the same and electronic deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Oct 20, 2009·35 cites·6 claims
- 3595US7508079B2Circuit substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Mar 24, 2009·41 cites·2 claims
- 3695US7415762B2Interposer, method of fabricating the same, and semiconductor device using the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 26, 2008·38 cites·3 claims
- 3795US7365436B2Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Apr 29, 2008·37 cites·6 claims
- 3895US7288841B2Laminated semiconductor packageSHINKO ELECTRIC IND CO·Filed 2006·Granted Oct 30, 2007·37 cites·9 claims
- 3995US7217888B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2003·Granted May 15, 2007·79 cites·6 claims
- 4095US6980416B2Capacitor, circuit board with built-in capacitor and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Dec 27, 2005·34 cites·13 claims
- 4195US6774467B2Semiconductor device and process of production of sameSHINKO ELECTRIC IND CO·Filed 2001·Granted Aug 10, 2004·178 cites·4 claims
- 4295US6229711B1Flip-chip mount board and flip-chip mount structure with improved mounting reliabilitySHINKO ELECTRIC IND CO·Filed 1999·Granted May 8, 2001·203 cites·20 claims
- 4395US6200888B1Method of producing semiconductor device comprising insulation layer having improved resistance and semiconductor device produced therebySHINKO ELECTRIC IND CO·Filed 2000·Granted Mar 13, 2001·124 cites·12 claims
- 4495US5918113AProcess for producing a semiconductor device using anisotropic conductive adhesiveSHINKO ELECTRIC IND CO·Filed 1997·Granted Jun 29, 1999·200 cites·14 claims
- 4595US5859471ASemiconductor device having tab tape lead frame with reinforced outer leadsSHINKO ELECTRIC IND CO·Filed 1997·Granted Jan 12, 1999·323 cites·15 claims
- 4695US5643433ALead frame and method for manufacturing sameSHINKO ELECTRIC IND CO·Filed 1993·Granted Jul 1, 1997·162 cites·7 claims
- 4795US5410180AMetal plane support for multi-layer lead frames and a process for manufacturing such framesSHINKO ELECTRIC IND CO·Filed 1993·Granted Apr 25, 1995·220 cites·26 claims
- 4894US12108520B2Circuit board and circuit moduleSHINKO ELECTRIC IND CO·Filed 2022·Granted Oct 1, 2024·2 cites·10 claims
- 4994US11802740B2Loop heat pipe with reinforcing memberSHINKO ELECTRIC IND CO·Filed 2021·Granted Oct 31, 2023·2 cites·11 claims
- 5094US9627309B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2016·Granted Apr 18, 2017·12 cites·8 claims
Showing the top 50 of 1,814 patent records by PatentIndex Score.
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