Electronic devices and its production methods

Abstract

An electronic device having mounted thereon an MEMS element or other functional elements, in which a device body and lid define an element-carrying space, the element-carrying space is sealed air-tight by an ultrasonic bonded part bonding the device body and the lid, and the element-carrying space having arranged inside it a system element secured to the device body and/or the lid by flip-chip connection.

1. An electronic device having mounted thereon a microelectromechanical system (MEMS) element comprising a micromachine component and an electronic component for operation of said micromachine component formed on a substrate of said MEMS element, in which:
 a lid having wiring patterns is bonded to the substrate of said MEMS element covering an active surface of said substrate, 
 an operating space for said micromachine component is defined by said substrate and said lid, 
 electrodes of said MEMS element and wiring patterns of said lid are electrically connected at a bonded part of said substrate and said lid, and 
 a sealing portion is provided between said MEMS element and said lid immediately surrounding and adjacent to an outside of said bonded part. 
 
   
   
     2. The electronic device as set forth in  claim 1 , in which said bonded part is an ultrasonic bonded part of said substrate and said lid. 
   
   
     3. The electronic device as set forth in  claim 1 , in which said substrate and/or said lid further have a cavity at the side of said operating space. 
   
   
     4. The electronic device as set forth in  claim 1 , in which said sealing portion comprises a continuous ultrasonic bonded part formed in contact with an outer periphery of an operating space side of said substrate and said lid without interruption. 
   
   
     5. The electronic device as set forth in  claim 1 , in which said substrate and/or said lid further comprise conductor-filled vias formed passing through said substrate and/or said lid in a thickness direction. 
   
   
     6. The electronic device as set forth in  claim 1 , in which said sealing portion comprises a sealing resin.