Inventor

HIGASHI MITSUTOSHI

JP132 patents

⚠️ This page may combine multiple inventors who share the name “HIGASHI MITSUTOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HIGASHI MITSUTOSHI

SHINKO ELECTRIC IND CO

Semiconductor device and method of production of same

Process for producing a semiconductor device using anisotropic conductive adhesive

Electronic devices and its production methods

Electronic parts packaging structure and method of manufacturing the same

Semiconductor device having external contact terminals and method for using the same

Semiconductor device and method of production of same

Semiconductor device having an element with circuit pattern thereon

Semiconductor device and mount structure thereof

Wiring board mounting a capacitor

Process for making a chip sized semiconductor device

Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film

Capacitor, circuit board with built-in capacitor and method for producing the same

Multi-layer circuit board using anisotropic electro-conductive adhesive layer

Semiconductor device

Semiconductor chip and method of manufacturing the same

Method of manufacturing substrate

Electronic parts packaging structure and method of manufacturing the same

Semiconductor device having through electrode and method of manufacturing the same

Circuit substrate and method of manufacturing the same

Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device

Electronic component device

Electronic component embedded substrate and method for manufacturing the same

Electronic parts packaging structure and method of manufacturing the same

Capacitor, circuit board with built-in capacitor and method of manufacturing the same

Method and apparatus for cutting a semiconductor wafer

Method for producing a multi-layer circuit board using anisotropic electro-conductive adhesive layer

Semiconductor device and method of production of same

Multi layer circuit board using anisotropic electroconductive adhesive layer and method for producing same

Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film

Semiconductor device and production method thereof

Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion

Semiconductor device module and a part thereof

Semiconductor device and process of producing same

Semiconductor device

Method of manufacturing one side resin sealing type semiconductor devices

Heat radiation package and semiconductor device

Method of manufacturing substrate

Electronic component and method for manufacturing the same

Electronic component and method for manufacturing the same

Method of manufacturing wiring board having a semiconductor thereon

Light-emitting device and method for manufacturing the same

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and method of manufacturing the same

Probe device

SUNOHARA MASAHIRO

Method of manufacturing wiring substrate

Method of manufacturing wiring substrate and method of manufacturing semiconductor device

NAGANOKEN AND SHINKO ELECTRIC

Aqueous solution for forming metal complexes, tin-silver alloy plating bath, and process for producing plated object using the plating bath

SHINKO ELECTRIC ELECTRIC IND CO LTD

Semiconductor inspecting device

MURAYAMA KEI

Semiconductor device having an element mounted on a substrate and an electrical component connected to the element