Assignee
SILICON PREC IND CO LTD
TW·3 granted patents·1 pending application·204 citations·filing 2000–2008
Top patents by PatentIndex Score
4 records- 0195US7443016B2Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulantSILICON PREC IND CO LTD·Filed 2005·Granted Oct 28, 2008·73 cites·10 claims
- 0295US6414384B1Package structure stacking chips on front surface and back surface of substrateSILICON PREC IND CO LTD·Filed 2000·Granted Jul 2, 2002·131 cites·20 claims
- 0352US7884456B2Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulantSILICON PREC IND CO LTD·Filed 2008·Granted Feb 8, 2011·0 cites·8 claims
- 0449US2008176358A1Fabrication method of multichip stacking structureSILICON PREC IND CO LTD·Filed 2008·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →