Assignee
SIM JAE-HWANG
KR·9 granted patents·2 pending applications·523 citations·filing 2008–2015
Top patents by PatentIndex Score
11 records- 0198US9166012B2Semiconductor memory devices including an air gap and methods of fabricating the sameSIM JAE-HWANG·Filed 2013·Granted Oct 20, 2015·479 cites·20 claims
- 0292US8142986B2Method of forming fine patterns of semiconductor deviceSIM JAE-HWANG·Filed 2008·Granted Mar 27, 2012·22 cites·27 claims
- 0381US8541284B2Method of manufacturing string floating gates with air gaps in betweenSIM JAE-HWANG·Filed 2011·Granted Sep 24, 2013·5 cites·20 claims
- 0480US8183152B2Method of fabricating semiconductor deviceSIM JAE-HWANG·Filed 2010·Granted May 22, 2012·5 cites·20 claims
- 0575US8921233B2Microelectronic fabrication methods using composite layers for double patterningSIM JAE-HWANG·Filed 2011·Granted Dec 30, 2014·3 cites·19 claims
- 0675US8592273B2Method of manufacturing nonvolatile memory deviceSIM JAE-HWANG·Filed 2011·Granted Nov 26, 2013·4 cites·13 claims
- 0772US8754464B2Non-volatile memory devices including gates having reduced widths and protection spacers and methods of manufacturing the sameSIM JAE-HWANG·Filed 2012·Granted Jun 17, 2014·3 cites·12 claims
- 0864US8680602B2Semiconductor device and method of manufacturing the sameSIM JAE-HWANG·Filed 2012·Granted Mar 25, 2014·2 cites·17 claims
- 0956US9041088B2Non-volatile memory devices having air gaps and methods of manufacturing the sameSIM JAE-HWANG·Filed 2014·Granted May 26, 2015·0 cites·21 claims
- 1047US2015287644A1Method of fabricating semiconductor deviceSIM JAE-HWANG·Filed 2015·Application pending·0 cites
- 1138US2012058639A1Semiconductor devices and methods of fabricating the sameSIM JAE-HWANG·Filed 2011·Application pending·0 cites
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