Assignee
ST ASSEMBLY TEST SERVICE LTD
SG·10 granted patents·1 pending application·318 citations·filing 2000–2004
Top patents by PatentIndex Score
11 records- 0196US6599779B2PBGA substrate for anchoring heat sinkST ASSEMBLY TEST SERVICE LTD·Filed 2001·Granted Jul 29, 2003·130 cites·11 claims
- 0288US6630373B2Ground plane for exposed packageST ASSEMBLY TEST SERVICE LTD·Filed 2002·Granted Oct 7, 2003·46 cites·15 claims
- 0387US6544812B1Single unit automated assembly of flex enhanced ball grid array packagesST ASSEMBLY TEST SERVICE LTD·Filed 2000·Granted Apr 8, 2003·45 cites·12 claims
- 0479US6627990B1Thermally enhanced stacked die packageST ASSEMBLY TEST SERVICE LTD·Filed 2003·Granted Sep 30, 2003·33 cites·56 claims
- 0573US6537857B2Enhanced BGA grounded heatsinkST ASSEMBLY TEST SERVICE LTD·Filed 2001·Granted Mar 25, 2003·18 cites·11 claims
- 0669US6535004B2Testing of BGA and other CSP packages using probing techniquesST ASSEMBLY TEST SERVICE LTD·Filed 2002·Granted Mar 18, 2003·12 cites·14 claims
- 0766US6468361B1PBGA singulated substrate for model melamine cleaningST ASSEMBLY TEST SERVICE LTD·Filed 2000·Granted Oct 22, 2002·8 cites·16 claims
- 0862US6581278B2Process and support carrier for flexible substratesST ASSEMBLY TEST SERVICE LTD·Filed 2001·Granted Jun 24, 2003·18 cites·16 claims
- 0950US6543127B1Coplanarity inspection at the singulation processST ASSEMBLY TEST SERVICE LTD·Filed 2000·Granted Apr 8, 2003·3 cites·14 claims
- 1040US6597188B1Ground land for singulated ball grid arrayST ASSEMBLY TEST SERVICE LTD·Filed 2000·Granted Jul 22, 2003·5 cites·9 claims
- 1136US2005194698A1Integrated circuit package with keep-out zone overlapping undercut zoneST ASSEMBLY TEST SERVICE LTD·Filed 2004·Application pending·0 cites
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