Assignee
STAKTEK GROUP LP
US·45 granted patents·39 pending applications·2,482 citations·filing 1998–2009
Top patents by PatentIndex Score
84 records- 0198US7324352B2High capacity thin module system and methodSTAKTEK GROUP LP·Filed 2005·Granted Jan 29, 2008·119 cites·3 claims
- 0298US7033861B1Stacked module systems and methodSTAKTEK GROUP LP·Filed 2005·Granted Apr 25, 2006·84 cites·22 claims
- 0398US6576992B1Chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2001·Granted Jun 10, 2003·162 cites·42 claims
- 0498US6205654B1Method of manufacturing a surface mount packageSTAKTEK GROUP LP·Filed 1998·Granted Mar 27, 2001·176 cites·27 claims
- 0597US7053478B2Pitch change and chip scale stacking systemSTAKTEK GROUP LP·Filed 2004·Granted May 30, 2006·139 cites·34 claims
- 0697US6956284B2Integrated circuit stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Oct 18, 2005·88 cites·14 claims
- 0797US6919626B2High density integrated circuit moduleSTAKTEK GROUP LP·Filed 2001·Granted Jul 19, 2005·96 cites·13 claims
- 0897US6914324B2Memory expansion and chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2003·Granted Jul 5, 2005·98 cites·15 claims
- 0997US6878571B2Panel stacking of BGA devices to form three-dimensional modulesSTAKTEK GROUP LP·Filed 2002·Granted Apr 12, 2005·112 cites·6 claims
- 1097US6572387B2Flexible circuit connector for stacked chip moduleSTAKTEK GROUP LP·Filed 2002·Granted Jun 3, 2003·100 cites·20 claims
- 1197US6282210B1Clock driver with instantaneously selectable phase and method for use in data communication systemsSTAKTEK GROUP LP·Filed 1998·Granted Aug 28, 2001·179 cites·12 claims
- 1296US7289327B2Active cooling methods and apparatus for modulesSTAKTEK GROUP LP·Filed 2006·Granted Oct 30, 2007·57 cites·9 claims
- 1396US7066741B2Flexible circuit connector for stacked chip moduleSTAKTEK GROUP LP·Filed 2003·Granted Jun 27, 2006·78 cites·6 claims
- 1496US7026708B2Low profile chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2003·Granted Apr 11, 2006·79 cites·25 claims
- 1595US7094632B2Low profile chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Aug 22, 2006·51 cites·6 claims
- 1694US7180167B2Low profile stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Feb 20, 2007·61 cites·10 claims
- 1793US6992501B2Reflection-control system and methodSTAKTEK GROUP LP·Filed 2004·Granted Jan 31, 2006·119 cites·48 claims
- 1893US6462408B1Contact member stacking system and methodSTAKTEK GROUP LP·Filed 2001·Granted Oct 8, 2002·63 cites·16 claims
- 1992US7193310B2Stacking system and methodSTAKTEK GROUP LP·Filed 2006·Granted Mar 20, 2007·21 cites·6 claims
- 2090US6940729B2Integrated circuit stacking system and methodSTAKTEK GROUP LP·Filed 2002·Granted Sep 6, 2005·37 cites·3 claims
- 2190US6908792B2Chip stack with differing chip package typesSTAKTEK GROUP LP·Filed 2002·Granted Jun 21, 2005·78 cites·5 claims
- 2290US6608763B1Stacking system and methodSTAKTEK GROUP LP·Filed 2000·Granted Aug 19, 2003·58 cites·24 claims
- 2389US7310458B2Stacked module systems and methodsSTAKTEK GROUP LP·Filed 2005·Granted Dec 18, 2007·18 cites·11 claims
- 2488US7081373B2CSP chip stack with flex circuitSTAKTEK GROUP LP·Filed 2001·Granted Jul 25, 2006·42 cites·9 claims
- 2588US6168970B1Ultra high density integrated circuit packagesSTAKTEK GROUP LP·Filed 1999·Granted Jan 2, 2001·64 cites·18 claims
- 2686US6288907B1High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain reliefSTAKTEK GROUP LP·Filed 1999·Granted Sep 11, 2001·66 cites·3 claims
- 2782US6622142B1Database utilitiesSTAKTEK GROUP LP·Filed 2000·Granted Sep 16, 2003·40 cites·24 claims
- 2880US6310392B1Stacked micro ball grid array packagesSTAKTEK GROUP LP·Filed 1998·Granted Oct 30, 2001·58 cites·17 claims
- 2978US7309914B2Inverted CSP stacking system and methodSTAKTEK GROUP LP·Filed 2005·Granted Dec 18, 2007·7 cites·14 claims
- 3077US6955945B2Memory expansion and chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Oct 18, 2005·13 cites·31 claims
- 3173US7259452B2Leaded package integrated circuit stackingSTAKTEK GROUP LP·Filed 2005·Granted Aug 21, 2007·4 cites·33 claims
- 3271US7323364B2Stacked module systems and methodSTAKTEK GROUP LP·Filed 2006·Granted Jan 29, 2008·3 cites·21 claims
- 3371US6806120B2Contact member stacking system and methodSTAKTEK GROUP LP·Filed 2002·Granted Oct 19, 2004·13 cites·3 claims
- 3470US6194247B1Warp-resistent ultra-thin integrated circuit package fabrication methodSTAKTEK GROUP LP·Filed 1998·Granted Feb 27, 2001·27 cites·1 claims
- 3565USRE39628EStackable flex circuit IC package and method of making sameSTAKTEK GROUP LP·Filed 2004·Granted May 15, 2007·8 cites·20 claims
- 3663US7304382B2Managed memory componentSTAKTEK GROUP LP·Filed 2006·Granted Dec 4, 2007·3 cites·32 claims
- 3762US7202555B2Pitch change and chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2005·Granted Apr 10, 2007·2 cites·7 claims
- 3860US7371609B2Stacked module systems and methodsSTAKTEK GROUP LP·Filed 2004·Granted May 13, 2008·5 cites·17 claims
- 3958US2009298230A1Stacked Module Systems and MethodsSTAKTEK GROUP LP·Filed 2009·Application pending·0 cites
- 4057US7335975B2Integrated circuit stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Feb 26, 2008·4 cites·30 claims
- 4156US7256484B2Memory expansion and chip scale stacking system and methodSTAKTEK GROUP LP·Filed 2004·Granted Aug 14, 2007·3 cites·12 claims
- 4256US6618257B1Wide data path stacking system and methodSTAKTEK GROUP LP·Filed 2001·Granted Sep 9, 2003·6 cites·34 claims
- 4354US6190939B1Method of manufacturing a warp resistant thermally conductive circuit packageSTAKTEK GROUP LP·Filed 1998·Granted Feb 20, 2001·16 cites·6 claims
- 4453US6404662B1Rambus stakpakSTAKTEK GROUP LP·Filed 1998·Granted Jun 11, 2002·19 cites·6 claims
- 4553US2007028201A1Enhanced routing grid system and methodSTAKTEK GROUP LP·Filed 2006·Application pending·0 cites
- 4651US2006255446A1Stacked modules and methodSTAKTEK GROUP LP·Filed 2006·Application pending·0 cites
- 4751US2005242423A1Stacked module systems and methodsSTAKTEK GROUP LP·Filed 2005·Application pending·0 cites
- 4851US2008088032A1Stacked Modules and MethodSTAKTEK GROUP LP·Filed 2007·Application pending·0 cites
- 4951US2008090329A1Stacked Modules and MethodSTAKTEK GROUP LP·Filed 2007·Application pending·0 cites
- 5050US2007126125A1Memory Module System and MethodSTAKTEK GROUP LP·Filed 2007·Application pending·0 cites
Showing the top 50 of 84 patent records by PatentIndex Score.
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