Stackable flex circuit IC package and method of making same

Abstract

A stackable flex circuit IC package includes a flex circuit comprised of a flexible base with a conductive pattern thereon, and wrapped around at least one end portion of a frame so as to expose the conductive pattern at the edge portion. An IC device is mounted within a central aperture in the frame, and is electrically coupled to the conductive pattern. The IC device is sealed in place within the frame with epoxy. A stack of the IC packages is assembled by disposing a conductive epoxy of anisotropic material between the conductive patterns at the edge portions of adjacent IC packages. Application of pressure in a vertical or Z-axis direction between adjacent IC packages completes electrical connections between the individual conductors of the conductive patterns of adjacent IC packages to interconnect the IC packages of the stack, while at the same time maintaining electrical isolation between adjacent conductors within each of the conductive patterns. The IC devices may comprise bare memory chips electrically coupled to the conductive pattern by wire bonds which are encapsulated in the epoxy together with the chip. Alternatively, where the IC devices comprise ball grid array (BGA) devices, such as chip scale packages, μBGAs, flip chips, or the like, the matrix of balls or other conductive elements on the device are disposed within apertures ablated through the flexible base of the flex circuit where they are soldered to the conductive pattern. A method of making the stackable flex circuit IC package secures the frame onto the flex circuit so that the flex circuit is wrapped around at least one end of the frame, secures the IC device to the flex circuit within the opening in the frame, electrically couples the IC device to the conductive pattern on the flex circuit, either by wire bonding in the case of a bare chip or by soldering the matrix of balls or other conductive elements to the conductive pattern of the flex circuit in the case of a BGA device, and then encapsulates the device with epoxy. A stack of the IC packages is formed by placing anisotropic conductive epoxy between the exposed conductive patterns of adjacent IC packages and pressing the IC packages together.

1. A stackable integrated circuit chip package, comprising:
 a flex circuit comprising: 
 a flexible base; and  
 a conductive pattern disposed on the flexible base;  
 
 a frame defining a central opening and opposed top and bottom surfaces, the flex circuit being wrapped around at least a portion of and secured to the frame such that the, conductive pattern defines a first portion which extends over a portion of the bottom surface of the frame and a second portion which extends over a portion of the top surface of the frame; and  
 an integrated circuit device disposed within the opening of the frame and secured to the flexible base of the flex circuit, the integrated circuit device being electrically connected to the conductive pattern;  
 the first and second portions of the conductive pattern each being electrically connectable to another component.  
 
     
     
       2. The chip package of  claim 1  further in combination with a second stackable integrated circuit chip package identically configured to the chip package, the first portion of the conductive pattern of the second chip package being electrically connected to the second portion of the conductive pattern of the chip package to form a chip stack. 
     
     
       3. The chip stack of  claim 2  wherein the first portion of the conductive pattern of the second chip package is electrically connected to the second portion of the conductive pattern of the chip package through the use of an anisotropic conductive epoxy. 
     
     
       4. The chip package of  claim 1  wherein:
 the integrated circuit device comprises a bare die; and  
 the bare die is electrically connected to the second portion of the conductive pattern via at least one conductive wire.  
 
     
     
       5. The chip package of  claim 4  wherein:
 the top surface of the frame defines at least one ramp which is recessed relative to the remainder thereof;  
 a portion of the second portion of the conductive pattern extends over the ramp; and  
 the bare die is electrically connected via the conductive wire to the portion of the second portion of the conductive pattern which extends over the ramp.  
 
     
     
       6. The chip package of  claim 5  further comprising a potting compound encapsulating the bare die and the at least one conductive wire within the central opening of the frame. 
     
     
       7. The chip package of  claim 1  wherein:
 the integrated circuit device comprises a BGA device including a body having an array of contacts disposed thereon;  
 the flexible base of the flex circuit includes a plurality of apertures extending therethrough to the first portion of the conductive pattern; and  
 the contacts of the BGA device are disposed within respective ones of the apertures and electrically connected to the first portion of the conductive pattern.  
 
     
     
       8. The chip package of  claim 7  wherein the contacts are electrically connected to the first portion of the conductive pattern via solder. 
     
     
       9. The chip package of  claim 7  further comprising a potting compound underfilling a gap defined between the body of the BGA device and the flexible base of the flex circuit. 
     
     
       10. The chip stack of  claim 1  wherein the flexible base extends across and completely covers one end of the central opening within the frame. 
     
     
       11. A chip stack comprising:
 at least first and second stackable integrated circuit chip packages, each of which comprises: 
 a flex circuit comprising: 
 a flexible base; and  
 a conductive pattern disposed on the flexible base;  
 
 a frame defining a central opening, the flex circuit being wrapped around at least a portion of and secured to the frame such that the conductive pattern defines a first portion which extends over a portion of the bottom surface of the frame and a second portion which extends over a portion of the top surface of the frame; and  
 an integrated circuit device disposed within the opening of the frame and secured to the flexible base of the flex circuit, the integrated circuit device being electrically connected to the conductive pattern;  
 the first portion of the conductive pattern of the second chip package being electrically connected to the second portion of the conductive pattern of the first chip package.  
 
 
     
     
       12. The chip stack of  claim 11  wherein the first portion of the conductive pattern of the first chip package is electrically connected to the second portion of the conductive pattern of the second chip package-via an anisotropic epoxy. 
     
     
       13. The chip stack of  claim 11  wherein the second chip package includes a plurality of contacts on the first portion of the conductive pattern thereof to facilitate electrical connection to a substrate board. 
     
     
       14. A stackable integrated circuit chip package, comprising:
 a flex circuit comprising: 
 a flexible base having a central aperture therein; and  
 a conductive pattern disposed on the flexible base;  
 
 a frame defining a central opening and opposed top and bottom surfaces, the flex circuit being wrapped around at least a portion of and secured to the frame such that the conductive pattern defines a first portion which extends over a portion of the bottom surface of the frame and a second portion which extends over a portion of the top surface of the frame; and  
 an integrated circuit device disposed within the central aperture of the flexible base and the central opening of the frame, the integrated circuit device being electrically connected to the conductive pattern;  
 the first and second portions of the conductive pattern each being electrically connectable to another component.  
 
     
     
       15. The chip package of  claim 14  further in combination with a second stackable integrated circuit chip package identically configured to the chip package, the first portion of the conductive pattern of the second chip package being electrically connected to the second portion of the conductive pattern of the chip package to form a chip stack. 
     
     
       16. The chip stack of  claim 15  wherein the first portion of the conductive pattern of the second chip package is electrically connected to the second portion of the conductive pattern of the chip package through the use of an anisotropic conductive epoxy. 
     
     
       17. The chip package of  claim 14  wherein:
 the integrated circuit device comprises a bare die; and  
 the bare die is electrically connected to the second portion of the conductive pattern via at least one conductive wire.  
 
     
     
       18. The chip package of  claim 17  wherein:
 the top surface of the frame defines at least one ramp which is recessed relative to the remainder thereof;  
 a portion of the second portion of the conductive pattern extends over the ramp; and  
 the bare die is electrically connected via the conductive wire to the portion. of the second portion of the conductive pattern which extends over the ramp.  
 
     
     
       19. The chip package of  claim 18  further comprising a potting compound partially encapsulating the bare die and-the at least one conductive wire within the central aperture of the flexible base and the central opening of the frame. 
     
     
       20. A stacked integrated circuit module comprising:
   a first ball grid array package having a first major surface and a second major surface and emergent from the second major surface there being a first matrix of balls, the first ball grid array package containing an integrated circuit chip;        a second ball grid array package having a first major surface and a second major surface and containing an integrated circuit chip, the second ball grid array package being disposed in a stacked disposition above the first ball grid array package;        a flex circuit connected on one side to the first matrix of balls of the first ball grid array package and connected on the other side to a second matrix of balls for the module the flex circuit further comprising a first portion and a second portion with the first and second portions being coplanarly disposed above the first major surface of the first ball grid array package and below the second major surface of the second ball grid array package, the first and second portions being electrically connected to the second ball grid array package.