Inventor · disambiguated record
Harlan R. Isaak
Also filed as: ISAAK HARLAN · ISAAK HARLAN R · ISAAK HARLAN RUBEN
18 granted patents·2 pending applications·2,486 citations·filing 1989–2004
97Inventor score
Files withDENSE PAC MICROSYSTEMS INC4NORTHROP GRUMMAN CORP3DPAC TECHNOLOGIES CORP2STAKTEK GROUP LP2HUGHES AIRCRAFT CO1
Top patents by PatentIndex Score
20 records- 0198US6472735B2Three-dimensional memory stacking using anisotropic epoxy interconnectionsFiled 2001·Granted Oct 29, 2002·209 cites·17 claims
- 0298US6404043B1Panel stacking of BGA devices to form three-dimensional modulesDENSE PAC MICROSYSTEMS INC·Filed 2000·Granted Jun 11, 2002·263 cites·20 claims
- 0398US6180881B1Chip stack and method of making sameFiled 1998·Granted Jan 30, 2001·439 cites·20 claims
- 0497US6878571B2Panel stacking of BGA devices to form three-dimensional modulesSTAKTEK GROUP LP·Filed 2002·Granted Apr 12, 2005·112 cites·6 claims
- 0597US6514793B2Stackable flex circuit IC package and method of making sameDPAC TECHNOLOGIES CORP·Filed 2001·Granted Feb 4, 2003·160 cites·6 claims
- 0697US6351029B1Stackable flex circuit chip package and method of making sameFiled 2000·Granted Feb 26, 2002·157 cites·17 claims
- 0797US5612570AChip stack and method of making sameDENSE PAC MICROSYSTEMS INC·Filed 1995·Granted Mar 18, 1997·341 cites·18 claims
- 0896US6426549B1Stackable flex circuit IC package and method of making sameFiled 2000·Granted Jul 30, 2002·94 cites·19 claims
- 0995US6566746B2Panel stacking of BGA devices to form three-dimensional modulesDPAC TECHNOLOGIES CORP·Filed 2001·Granted May 20, 2003·71 cites·39 claims
- 1095US6426240B2Stackable flex circuit chip package and method of making sameFiled 2001·Granted Jul 30, 2002·100 cites·30 claims
- 1195US6323060B1Stackable flex circuit IC package and method of making sameDENSE PAC MICROSYSTEMS INC·Filed 1999·Granted Nov 27, 2001·146 cites·5 claims
- 1293US6544815B2Panel stacking of BGA devices to form three-dimensional modulesFiled 2001·Granted Apr 8, 2003·43 cites·8 claims
- 1391US5869353AModular panel stacking processDENSE PAC MICROSYSTEMS INC·Filed 1997·Granted Feb 9, 1999·298 cites·6 claims
- 1465USRE39628EStackable flex circuit IC package and method of making sameSTAKTEK GROUP LP·Filed 2004·Granted May 15, 2007·8 cites·20 claims
- 1559US5003870AAntistretch screen printing arrangementHUGHES AIRCRAFT CO·Filed 1989·Granted Apr 2, 1991·10 cites·17 claims
- 1656US5621193ACeramic edge connect processNORTHROP GRUMMAN CORP·Filed 1995·Granted Apr 15, 1997·21 cites·6 claims
- 1742US2003064548A1Panel stacking of BGA devices to form three-dimensional modulesFiled 2002·Application pending·0 cites
- 1842US2002094603A1Three-dimensional memory stacking using anisotropic epoxy interconnectionsFiled 2002·Application pending·0 cites
- 1941US5661267ADetector alignment boardNORTHROP GRUMMAN CORP·Filed 1995·Granted Aug 26, 1997·8 cites·10 claims
- 2038US5832599AMethod of interfacing detector array layersNORTHROP GRUMMAN CORP·Filed 1997·Granted Nov 10, 1998·6 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →