Assignee
STATS CHIPPAC PTE LTD
SG·227 granted patents·165 pending applications·459 citations·filing 2013–2025
Top patents by PatentIndex Score
392 records- 0198US11610847B2Laser-based redistribution and multi-stacked packagesSTATS CHIPPAC PTE LTD·Filed 2021·Granted Mar 21, 2023·7 cites·22 claims
- 0298US10297518B2Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale packageSTATS CHIPPAC PTE LTD·Filed 2016·Granted May 21, 2019·47 cites·23 claims
- 0397US11862572B2Laser-based redistribution and multi-stacked packagesSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jan 2, 2024·4 cites·25 claims
- 0497US11640944B2Semiconductor device and method of forming a slot in EMI shielding layer using a plurality of slot lines to guide a laserSTATS CHIPPAC PTE LTD·Filed 2021·Granted May 2, 2023·4 cites·31 claims
- 0597US10797024B2System-in-package with double-sided moldingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Oct 6, 2020·6 cites·25 claims
- 0697US10636765B2System-in-package with double-sided moldingSTATS CHIPPAC PTE LTD·Filed 2017·Granted Apr 28, 2020·24 cites·21 claims
- 0797US10304817B2Semiconductor device and method of forming build-up interconnect structures over a temporary substrateSTATS CHIPPAC PTE LTD·Filed 2017·Granted May 28, 2019·17 cites·22 claims
- 0897US9806040B2Antenna in embedded wafer-level ball-grid array packageSTATS CHIPPAC PTE LTD·Filed 2016·Granted Oct 31, 2017·19 cites·25 claims
- 0996US12094729B2Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSPSTATS CHIPPAC PTE LTD·Filed 2021·Granted Sep 17, 2024·2 cites·22 claims
- 1096US11830785B2Package with windowed heat spreaderSTATS CHIPPAC PTE LTD·Filed 2021·Granted Nov 28, 2023·4 cites·21 claims
- 1196US11393698B2Mask design for improved attach positionSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jul 19, 2022·4 cites·22 claims
- 1296US11024561B2Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect unitsSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 1, 2021·3 cites·25 claims
- 1395US12362287B2Semiconductor device and method of making double shielding layers over the semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jul 15, 2025·2 cites·17 claims
- 1495US11935840B2Semiconductor device with partial EMI shielding removal using laser ablationSTATS CHIPPAC PTE LTD·Filed 2022·Granted Mar 19, 2024·2 cites·23 claims
- 1595US11444035B2Semiconductor device with partial EMI shielding removal using laser ablationSTATS CHIPPAC PTE LTD·Filed 2020·Granted Sep 13, 2022·3 cites·25 claims
- 1695US10784210B2Semiconductor device with partial EMI shielding removal using laser ablationSTATS CHIPPAC PTE LTD·Filed 2018·Granted Sep 22, 2020·11 cites·21 claims
- 1795US10510703B2Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor packageSTATS CHIPPAC PTE LTD·Filed 2017·Granted Dec 17, 2019·8 cites·25 claims
- 1895US10388637B2Semiconductor device and method of forming a 3D interposer system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2017·Granted Aug 20, 2019·8 cites·24 claims
- 1995US10217702B2Semiconductor device and method of forming an embedded SoP fan-out packageSTATS CHIPPAC PTE LTD·Filed 2016·Granted Feb 26, 2019·13 cites·23 claims
- 2094US11990424B2Selective EMI shielding using preformed maskSTATS CHIPPAC PTE LTD·Filed 2023·Granted May 21, 2024·2 cites·22 claims
- 2194US11862478B2Mask design for improved attach positionSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jan 2, 2024·2 cites·25 claims
- 2294US10937741B2Molded laser package with electromagnetic interference shield and method of makingSTATS CHIPPAC PTE LTD·Filed 2018·Granted Mar 2, 2021·10 cites·25 claims
- 2394US10297519B2Semiconductor device and method of forming PoP semiconductor device with RDL over top packageSTATS CHIPPAC PTE LTD·Filed 2017·Granted May 21, 2019·9 cites·18 claims
- 2494US10211171B2Antenna in embedded wafer-level ball-grid array packageSTATS CHIPPAC PTE LTD·Filed 2017·Granted Feb 19, 2019·10 cites·23 claims
- 2593US12107058B2Split RDL connection between die and UBMSTATS CHIPPAC PTE LTD·Filed 2021·Granted Oct 1, 2024·2 cites·21 claims
- 2693US11823973B2Package with compartmentalized lid for heat spreader and EMI shieldSTATS CHIPPAC PTE LTD·Filed 2021·Granted Nov 21, 2023·2 cites·24 claims
- 2793US11735489B2Semiconductor device and method of forming hybrid TIM layersSTATS CHIPPAC PTE LTD·Filed 2021·Granted Aug 22, 2023·2 cites·25 claims
- 2893US11735530B2Semiconductor device and method of integrating RF antenna interposer with semiconductor packageSTATS CHIPPAC PTE LTD·Filed 2021·Granted Aug 22, 2023·2 cites·21 claims
- 2993US11488933B2Semiconductor device and method of forming embedded wafer level chip scale packagesSTATS CHIPPAC PTE LTD·Filed 2020·Granted Nov 1, 2022·2 cites·24 claims
- 3093US11189598B2Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the sameSTATS CHIPPAC PTE LTD·Filed 2019·Granted Nov 30, 2021·7 cites·25 claims
- 3193US10985109B2Shielded semiconductor packages with open terminals and methods of making via two-step processSTATS CHIPPAC PTE LTD·Filed 2018·Granted Apr 20, 2021·10 cites·25 claims
- 3293US10475779B2Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSPSTATS CHIPPAC PTE LTD·Filed 2017·Granted Nov 12, 2019·7 cites·25 claims
- 3393US10468384B2Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the sameSTATS CHIPPAC PTE LTD·Filed 2017·Granted Nov 5, 2019·7 cites·24 claims
- 3492US11784133B2Shielded semiconductor package with open terminal and methods of makingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Oct 10, 2023·2 cites·25 claims
- 3592US11088082B2Semiconductor device with partial EMI shielding and method of making the sameSTATS CHIPPAC PTE LTD·Filed 2018·Granted Aug 10, 2021·7 cites·23 claims
- 3692US10804217B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2019·Granted Oct 13, 2020·6 cites·22 claims
- 3792US10189702B2Semiconductor device and method of forming microelectromechanical systems (MEMS) packageSTATS CHIPPAC PTE LTD·Filed 2016·Granted Jan 29, 2019·4 cites·23 claims
- 3892US9978665B2Semiconductor device and method of forming low profile fan-out package with vertical interconnection unitsSTATS CHIPPAC PTE LTD·Filed 2017·Granted May 22, 2018·7 cites·25 claims
- 3991US11887863B2Double-sided partial molded SIP moduleSTATS CHIPPAC PTE LTD·Filed 2021·Granted Jan 30, 2024·2 cites·19 claims
- 4091US11616025B2Selective EMI shielding using preformed mask with fang designSTATS CHIPPAC PTE LTD·Filed 2020·Granted Mar 28, 2023·2 cites·23 claims
- 4191US10797039B2Semiconductor device and method of forming a 3D interposer system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2018·Granted Oct 6, 2020·6 cites·21 claims
- 4291US10388612B2Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuitsSTATS CHIPPAC PTE LTD·Filed 2017·Granted Aug 20, 2019·6 cites·21 claims
- 4390US11688718B2Semiconductor device and method of controlling warpage during LABSTATS CHIPPAC PTE LTD·Filed 2021·Granted Jun 27, 2023·2 cites·20 claims
- 4490US11670618B2System-in-package with double-sided moldingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 6, 2023·2 cites·25 claims
- 4590US11664327B2Selective EMI shielding using preformed maskSTATS CHIPPAC PTE LTD·Filed 2020·Granted May 30, 2023·2 cites·22 claims
- 4690US11342278B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2020·Granted May 24, 2022·2 cites·23 claims
- 4790US10700011B2Semiconductor device and method of forming an integrated SIP module with embedded inductor or packageSTATS CHIPPAC PTE LTD·Filed 2017·Granted Jun 30, 2020·7 cites·22 claims
- 4890US10629531B2Semiconductor device and method of fabricating 3D package with short cycle time and high yieldSTATS CHIPPAC PTE LTD·Filed 2018·Granted Apr 21, 2020·5 cites·24 claims
- 4990US10446523B2Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLPSTATS CHIPPAC PTE LTD·Filed 2016·Granted Oct 15, 2019·5 cites·25 claims
- 5089US10910322B2Shielded semiconductor package with open terminal and methods of makingSTATS CHIPPAC PTE LTD·Filed 2018·Granted Feb 2, 2021·4 cites·19 claims
Showing the top 50 of 392 patent records by PatentIndex Score.
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