Assignee
STMICROELECTRONICS (MALTA) LTD
MT·18 granted patents·2 pending applications·16 citations·filing 2012–2023
Top patents by PatentIndex Score
20 records- 0179US9620438B2Electronic device with heat dissipaterSTMICROELECTRONICS (MALTA) LTD·Filed 2015·Granted Apr 11, 2017·5 cites·23 claims
- 0276US9253579B2Package for a MEMS sensor and manufacturing process thereofSTMICROELECTRONICS MALTA LTD·Filed 2012·Granted Feb 2, 2016·4 cites·28 claims
- 0373US10329143B2Package with chambers for dies and manufacturing process thereofSTMICROELECTRONICS MALTA LTD·Filed 2015·Granted Jun 25, 2019·2 cites·10 claims
- 0472US12017910B2Method of manufacturing electronic devices and corresponding electronic deviceSTMICROELECTRONICS MALTA LTD·Filed 2022·Granted Jun 25, 2024·0 cites·19 claims
- 0571US10435290B2Wafer level package for a MEMS sensor device and corresponding manufacturing processSTMICROELECTRONICS MALTA LTD·Filed 2017·Granted Oct 8, 2019·2 cites·17 claims
- 0664US9527727B2Packages for semiconductor devices and methods for assembling sameSTMICROELECTRONICS (MALTA) LTD·Filed 2014·Granted Dec 27, 2016·2 cites·21 claims
- 0763US11524892B2Method of manufacturing electronic devices and corresponding electronic deviceSTMICROELECTRONICS MALTA LTD·Filed 2020·Granted Dec 13, 2022·0 cites·19 claims
- 0860US9257372B2Surface mount package for a semiconductor integrated device, related assembly and manufacturing processSTMICROELECTRONICS MALTA LTD·Filed 2013·Granted Feb 9, 2016·1 cites·16 claims
- 0956US12494419B2Integrated circuit package with warpage control using cavity formed in laminated substrate below the integrated circuit dieSTMICROELECTRONICS MALTA LTD·Filed 2022·Granted Dec 9, 2025·0 cites·24 claims
- 1055US10882738B2Wafer level package for a mems sensor device and corresponding manufacturing processSTMICROELECTRONICS MALTA LTD·Filed 2019·Granted Jan 5, 2021·0 cites·20 claims
- 1154US2024038610A1Semiconductor packaging with transparency and method of manufacturing the sameSTMICROELECTRONICS MALTA LTD·Filed 2023·Application pending·0 cites
- 1245US9802813B2Wafer level package for a MEMS sensor device and corresponding manufacturing processSTMICROELECTRONICS (MALTA) LTD·Filed 2015·Granted Oct 31, 2017·0 cites·22 claims
- 1342US11352251B2Electronic device and corresponding manufacturing methodSTMICROELECTRONICS MALTA LTD·Filed 2020·Granted Jun 7, 2022·0 cites·15 claims
- 1441US9290377B2Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor deviceSTMICROELECTRONICS MALTA LTD·Filed 2014·Granted Mar 22, 2016·0 cites·12 claims
- 1540US9390988B2Method for soldering a cap to a support layerSTMICROELECTRONICS MALTA LTD·Filed 2012·Granted Jul 12, 2016·0 cites·19 claims
- 1639US10870207B2Barrel cap attach traysSTMICROELECTRONICS MALTA LTD·Filed 2017·Granted Dec 22, 2020·0 cites·15 claims
- 1738US12362213B2Tray carrier and corresponding methodSTMICROELECTRONICS MALTA LTD·Filed 2022·Granted Jul 15, 2025·0 cites·7 claims
- 1833US9698040B2Semiconductor device carrier tape with image sensor detectable dimplesSTMICROELECTRONICS (MALTA) LTD·Filed 2015·Granted Jul 4, 2017·0 cites·17 claims
- 1930US2016368098A1Method of manufacturing electronic components and corresponding electronic componentSTMICROELECTRONICS (MALTA) LTD·Filed 2016·Application pending·0 cites
- 2028US10431514B2Semiconductor packages having dual encapsulation materialSTMICROELECTRONICS MALTA LTD·Filed 2017·Granted Oct 1, 2019·0 cites·18 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →