Assignee
SUH MIN SUK
KR·8 granted patents·1 pending application·61 citations·filing 2008–2011
Top patents by PatentIndex Score
9 records- 0191US8299592B2Cube semiconductor package composed of a plurality of stacked together and interconnected semiconductor chip modulesSUH MIN SUK·Filed 2009·Granted Oct 30, 2012·22 cites·20 claims
- 0289US8232654B2Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the sameSUH MIN SUK·Filed 2011·Granted Jul 31, 2012·10 cites·14 claims
- 0388US8319327B2Semiconductor package with stacked chips and method for manufacturing the sameSUH MIN SUK·Filed 2011·Granted Nov 27, 2012·10 cites·18 claims
- 0487US8159065B2Semiconductor package having an internal cooling systemSUH MIN SUK·Filed 2009·Granted Apr 17, 2012·14 cites·10 claims
- 0568US8203217B2Semiconductor package having a stacked wafer level package and method for fabricating the sameSUH MIN SUK·Filed 2011·Granted Jun 19, 2012·2 cites·8 claims
- 0668US8097933B2Flexible semiconductor package and method for fabricating the sameSUH MIN SUK·Filed 2009·Granted Jan 17, 2012·3 cites·10 claims
- 0756US8299582B2Substrate for semiconductor package and semiconductor package having the sameSUH MIN SUK·Filed 2008·Granted Oct 30, 2012·0 cites·19 claims
- 0849US8524530B2Flexible semiconductor package and method for fabricating the sameSUH MIN SUK·Filed 2011·Granted Sep 3, 2013·0 cites·4 claims
- 0948US2011287584A1Semiconductor package having side walls and method for manufacturing the sameSUH MIN SUK·Filed 2011·Application pending·0 cites
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