Assignee
SUMITOMO METAL SMI ELECTRONICS
JP·27 granted patents·2 pending applications·739 citations·filing 1995–2006
Top patents by PatentIndex Score
29 records- 0192US5912505ASemiconductor package and semiconductor deviceSUMITOMO METAL SMI ELECTRONICS·Filed 1996·Granted Jun 15, 1999·149 cites·21 claims
- 0288US6544654B1Thick-film resistor and ceramic circuit boardSUMITOMO METAL SMI ELECTRONICS·Filed 2000·Granted Apr 8, 2003·23 cites·5 claims
- 0388US5601638AThick film pasteSUMITOMO METAL SMI ELECTRONICS·Filed 1995·Granted Feb 11, 1997·71 cites·11 claims
- 0486US6495394B1Chip package and method for manufacturing the sameSUMITOMO METAL SMI ELECTRONICS·Filed 2000·Granted Dec 17, 2002·37 cites·9 claims
- 0584US5855711AMethod of producing a ceramic circuit substrateSUMITOMO METAL SMI ELECTRONICS·Filed 1997·Granted Jan 5, 1999·83 cites·4 claims
- 0680US6861747B2Radiation type BGA package and production method thereforSUMITOMO METAL SMI ELECTRONICS·Filed 2002·Granted Mar 1, 2005·39 cites·19 claims
- 0780US6054755ASemiconductor package with improved moisture vapor relief function and method of fabricating the sameSUMITOMO METAL SMI ELECTRONICS·Filed 1998·Granted Apr 25, 2000·88 cites·6 claims
- 0878US6249053B1Chip package and method for manufacturing the sameSUMITOMO METAL SMI ELECTRONICS·Filed 1999·Granted Jun 19, 2001·44 cites·4 claims
- 0976US7632716B2Package for high frequency usages and its manufacturing methodSUMITOMO METAL SMI ELECTRONICS·Filed 2006·Granted Dec 15, 2009·14 cites·4 claims
- 1067US6489679B2High-frequency packageSUMITOMO METAL SMI ELECTRONICS·Filed 2000·Granted Dec 3, 2002·23 cites·13 claims
- 1160US6620650B2Chip package and method for manufacturing the sameSUMITOMO METAL SMI ELECTRONICS·Filed 2002·Granted Sep 16, 2003·8 cites·5 claims
- 1255US5879788ALow-temperature fired ceramic circuit substrate and thick-film paste for use in fabrication thereofSUMITOMO METAL SMI ELECTRONICS·Filed 1997·Granted Mar 9, 1999·18 cites·7 claims
- 1351US7023084B2Plastic packaging with high heat dissipation and method for the sameSUMITOMO METAL SMI ELECTRONICS·Filed 2003·Granted Apr 4, 2006·7 cites·7 claims
- 1450US6123874AThick-film resistor pasteSUMITOMO METAL SMI ELECTRONICS·Filed 1998·Granted Sep 26, 2000·17 cites·5 claims
- 1550US6060967ASurface mount filter with dielectric block through holes connected to striplines grounded by capacitorsSUMITOMO METAL SMI ELECTRONICS·Filed 1998·Granted May 9, 2000·12 cites·8 claims
- 1649US6242694B1Package for housing a photosemiconductor deviceSUMITOMO METAL SMI ELECTRONICS·Filed 1998·Granted Jun 5, 2001·28 cites·5 claims
- 1747US5955938ARuO2 resistor paste, substrate and overcoat systemSUMITOMO METAL SMI ELECTRONICS·Filed 1997·Granted Sep 21, 1999·10 cites·6 claims
- 1845US5729893AProcess for producing a multilayer ceramic circuit substrateSUMITOMO METAL SMI ELECTRONICS·Filed 1995·Granted Mar 24, 1998·12 cites·3 claims
- 1943US5766516ASilver-based conductive paste and multilayer ceramic circuit substrate using the sameSUMITOMO METAL SMI ELECTRONICS·Filed 1996·Granted Jun 16, 1998·11 cites·4 claims
- 2041US6064283ADielectric filterSUMITOMO METAL SMI ELECTRONICS·Filed 1998·Granted May 16, 2000·8 cites·9 claims
- 2141US6037045AThick-film paste and ceramic circuit substrate using the sameSUMITOMO METAL SMI ELECTRONICS·Filed 1997·Granted Mar 14, 2000·9 cites·9 claims
- 2239US5661090AProcess and apparatus for manufacturing ceramic semiconductor packagesSUMITOMO METAL SMI ELECTRONICS·Filed 1996·Granted Aug 26, 1997·12 cites·7 claims
- 2338US2005221537A1Plastic packaging with high heat dissipation and method for the sameSUMITOMO METAL SMI ELECTRONICS·Filed 2005·Application pending·0 cites
- 2436US6306526B1Semiconductor packaging metal lidSUMITOMO METAL SMI ELECTRONICS·Filed 1999·Granted Oct 23, 2001·8 cites·12 claims
- 2533US5723073AConductive paste containing 2-tetradecanol and ceramic circuit substrate using the sameSUMITOMO METAL SMI ELECTRONICS·Filed 1996·Granted Mar 3, 1998·4 cites·10 claims
- 2628US6781488B2Connected construction of a high-frequency package and a wiring boardSUMITOMO METAL SMI ELECTRONICS·Filed 2002·Granted Aug 24, 2004·0 cites·7 claims
- 2726US5821455ALid with variable solder layer for sealing semiconductor package, package having the lid and method for producing the lidSUMITOMO METAL SMI ELECTRONICS·Filed 1997·Granted Oct 13, 1998·3 cites·19 claims
- 2826US2002051353A1High-frequency ceramic packageSUMITOMO METAL SMI ELECTRONICS·Filed 2001·Application pending·0 cites
- 2912US6222582B1Image capture systemSUMITOMO METAL SMI ELECTRONICS·Filed 1998·Granted Apr 24, 2001·1 cites·5 claims
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