Plastic packaging with high heat dissipation and method for the same

Abstract

The present invention provides a high heat dissipation plastic package and a method for making the same that provides an inexpensive, thin high heat dissipation plastic package with good bonding precision and minimal bleeding of adhesive resin. A Cu foil resin film is formed by bonding an adhesive resin to a Cu foil and pre-forming, at an essentially central position, a cut-out for a cavity used to mount a semiconductor element. The Cu foil resin film is bonded using the adhesive resin directly to a heat dissipation plate. A conductor wiring pattern is formed on the Cu foil resin film. Furthermore, the heat dissipation plate includes a stopping section used to prevent resin from bleeding onto a cavity when bonding with the adhesive resin of the Cu foil resin film.

1 - 2 . (canceled)  
   
   
       3 . A method for making a high heat dissipation plastic package comprising: 
 a step for forming said Cu foil resin film by bonding an adhesive resin to a Cu foil and forming in advance a cut-out in said Cu foil resin film for a cavity used to mount a semiconductor element; and    a step for forming a metal member by roughening a surface of said heat dissipation plate and adhesing said metal member with said adhesive resin section of said Cu foil resin film by applying heat and pressure.    
   
   
       4 . A method for making a high heat dissipation plastic package comprising: 
 a step for forming said Cu foil resin film by bonding an adhesive resin to a Cu foil and forming in advance a cut-out in said Cu foil resin film for a cavity used to mount a semiconductor element; and    a step for forming a hole for a through-hole on said heat dissipation plate, forming a metal member by roughening a surface of said heat dissipation plate, directly abutting a first surface of said metal member to said adhesive resin section of said Cu foil resin film formed with said cut-out, abutting said Cu foil to a second surface of said metal member by way of a tack-dry resin, and applying pressure and heat to provide adhesion.    
   
   
       5 . A method for making a high heat dissipation plastic package comprising: 
 a step for forming in advance a cut-out for a cavity to mount a semiconductor element in a first Cu foil resin film, said Cu foil resin film being formed from a first and a second Cu foil resin film formed by bonding Cu film to adhesive resin; and    a step for directly abutting a first surface of said metal member to said adhesive resin section of said first Cu foil resin film formed with said cut-out, directly abutting a second surface of said metal member to said adhesive resin section of said second Cu foil resin film, and applying pressure and heat to provide adhesion, said heat dissipation plate including a hole for a through-hole and a metal member on which surface roughening was performed.    
   
   
       6 - 8 . (canceled)  
   
   
       9 . A method for making a high heat dissipation plastic package wherein a Cu foil resin film, formed by bonding an adhesive resin to a Cu foil and prepared in advance with a cut-out for a cavity used to mount a semiconductor element at an essentially central position when seen from above, is directly bonded using said adhesive resin to a heat dissipation plate used for dissipating heat generated by said semiconductor element, comprising: 
 a step for forming a shelf or groove on said heat dissipation plate along edges of said cut-out in said Cu foil resin film; and    a step for heating said adhesive resin and bonding said Cu foil resin film with said heat dissipation plate and stopping bleeding of said adhesive resin onto said cavity with said shelf or groove.    
   
   
       10 . A method for making a high heat dissipation plastic package wherein a Cu foil resin film, formed by bonding an adhesive resin to a Cu foil and prepared in advance with a cut-out for a cavity used to mount a semiconductor element at an essentially central position when seen from above, is directly bonded using said adhesive resin to a heat dissipation plate used for dissipating heat generated by said semiconductor element, comprising: 
 a step for using a holding tool including a projection that can fit into said cut-out in said Cu foil resin film to push a release film, interposed by a low-melting resin film, on said cavity and said Cu foil resin film;    a step for heating said adhesive resin and bonding said Cu foil resin film with said heat dissipation plate, and using said release film, interposed by said low-melting resin film, to stop said adhesive resin from bleeding onto said cavity; and    a step for removing said holding tool and removing said release film, interposed with said low-melting resin.    
   
   
       11 - 12 . (canceled)