Assignee
TAIWAN SEMICONDUCTOR MFG COMPANY LTD
TW·25 granted patents·52 pending applications·0 citations·filing 2021–2025
Top patents by PatentIndex Score
77 records- 0195US2026101806A1Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0291US2026101715A1Package structureTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0390US2026101741A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0489US2026101713A1Mechanical wafer alignment detection for bonding processTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0587US2026101533A1Semiconductor DeviceTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0686US2026101726A1Method of manufacturing a semiconductor device and semiconductor device manufacturing toolTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0785US12595167B2Dual micro-electro mechanical system and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Granted Apr 7, 2026·0 cites·20 claims
- 0885US2026101579A1Semiconductor device structure with air gapTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0985US2026099095A1Device and method to promote thickness uniformity in spin-coatingTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 1084US2026101590A1Method for semiconductor manufacturing and system for arranging a layoutTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 1183US2026097463A1Semiconductor device fabrication methods and devices for forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 1282US2026101681A1Wafer bonding method and semiconductor structure obtained by the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 1382US2026101791A1Semiconductor structures and methods for manufacturing the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 1482US2026101538A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 1581US2026101684A1Wafer bonding method and semiconductor structure manufactured using the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 1680US12597940B2Circuitry and method for reducing environmental noiseTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Granted Apr 7, 2026·0 cites·20 claims
- 1777US12596227B2Multi-layer waveguide optical couplerTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Granted Apr 7, 2026·0 cites·20 claims
- 1877US12597466B2Semiconductor memory devices with differential threshold voltagesTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Granted Apr 7, 2026·0 cites·20 claims
- 1977US2026101767A1Method of forming mark on semiconductor deviceTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 2076US12598763B2Semiconductor device structure with metal gate stackTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 2174US12596494B2Integrated circuit and method of forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 2273US12599009B2Package structureTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2021·Granted Apr 7, 2026·0 cites·20 claims
- 2373US2026099092A1Photoresist, method of manufacturing a semiconductor device and method of extreme ultraviolet lithographyTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 2472US2026101557A1Contact Formation Method and Related StructureTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 2570US12598831B2Pixel shielding using air gapsTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 2670US12598762B2Methods of manufacturing a semiconductor device with local isolation and a semiconductor device with local isolationTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2022·Granted Apr 7, 2026·0 cites·20 claims
- 2769US12594571B2Method and apparatus for reducing solvent consumptionTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2021·Granted Apr 7, 2026·0 cites·20 claims
- 2869US12597895B2Low-noise amplifier with MOM Q enhancementTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Granted Apr 7, 2026·0 cites·20 claims
- 2969US12598971B2Conductive via with improved gap filling performanceTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2022·Granted Apr 7, 2026·0 cites·20 claims
- 3068US2026101566A1Source/Drain Epitaxial Structures For High Voltage TransistorsTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 3167US2026099087A1Methods of manufacturing semiconductor device and extreme ultraviolet photolithography systemsTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Application pending·0 cites
- 3266US12598757B2Structure and formation method of package with hybrid interconnectionTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 3365US12599011B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 3465US2026097367A1Filter cleaning methods and apparatusesTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Application pending·0 cites
- 3564US2026101799A1Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Application pending·0 cites
- 3663US12599042B2Carrier structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 3763US2026101749A1Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Application pending·0 cites
- 3863US2026101714A1Stacking structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Application pending·0 cites
- 3963US2026101597A1Semiconductor devices and methods of formationTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Application pending·0 cites
- 4062US12596301B2Reticle inspection and purging method and toolTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 4162US12598764B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 4261US12598825B2Substrate contact in wafer backsideTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 4361US12598801B2Semiconductor device of physical unclonable function and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 4460US12598985B2Semiconductor structure and forming method thereofTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 4560US12598795B2Semiconductor devices and method of forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2022·Granted Apr 7, 2026·0 cites·20 claims
- 4660US2026101745A1Back-side power rail device and method of making sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Application pending·0 cites
- 4760US2026099126A1Time-to-digital conversion deviceTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 4859US2026101601A1Pixel sensor and methods for manufacturing pixel sensor and deep trench isolation structure thereofTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Application pending·0 cites
- 4959US2026100221A1Compute-in-memory circuits and methods for operating the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 5059US2026101531A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 77 patent records by PatentIndex Score.
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