Assignee
TAIWAN UNION TECHNOLOGY CORP
TW·36 granted patents·14 pending applications·10 citations·filing 2009–2025
Top patents by PatentIndex Score
50 records- 0191US10196502B2Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2016·Granted Feb 5, 2019·4 cites·16 claims
- 0283US10575401B1Dielectric composite and uses thereofTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted Feb 25, 2020·1 cites·18 claims
- 0382US10689512B2Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2017·Granted Jun 23, 2020·1 cites·21 claims
- 0481US11529797B2Method of manufacturing metal-clad laminate and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2017·Granted Dec 20, 2022·1 cites·16 claims
- 0578US10662352B2Adhesive composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted May 26, 2020·1 cites·20 claims
- 0677US12485651B2Metal-clad laminateTAIWAN UNION TECHNOLOGY CORP·Filed 2024·Granted Dec 2, 2025·0 cites·10 claims
- 0774US11818838B2Metal-clad laminate and manufacturing method of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Nov 14, 2023·2 cites·8 claims
- 0874US10774216B2Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Sep 15, 2020·0 cites·15 claims
- 0972US11345813B2Resin composition, pre-preg, metal-clad laminate, and printed circuit board using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted May 31, 2022·0 cites·14 claims
- 1070US11802198B2Fluororesin composition, and resin sheet, laminate and printed circuit boardTAIWAN UNION TECHNOLOGY CORP·Filed 2020·Granted Oct 31, 2023·0 cites·18 claims
- 1169US12446150B2Prepreg and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2024·Granted Oct 14, 2025·0 cites·14 claims
- 1269US12428550B2Resin composition and uses thereofTAIWAN UNION TECHNOLOGY CORP·Filed 2022·Granted Sep 30, 2025·0 cites·17 claims
- 1368US2025163269A1Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1468US2025129242A1Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1567US11124613B2Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Sep 21, 2021·0 cites·19 claims
- 1667US10513607B2Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2016·Granted Dec 24, 2019·0 cites·12 claims
- 1766US11008456B2Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted May 18, 2021·0 cites·19 claims
- 1865US12479988B2Resin composition and uses thereofTAIWAN UNION TECHNOLOGY CORP·Filed 2023·Granted Nov 25, 2025·0 cites·18 claims
- 1964US11124614B2Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed circuit board using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted Sep 21, 2021·0 cites·17 claims
- 2064US2010255740A1Epoxy resin blendTAIWAN UNION TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
- 2163US2024084135A1Resin composition, and prepreg, metal-clad laminate and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 2263US2024084063A1Solvent-free resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 2362US2014039094A1Epoxy resin composition, and prepreg and printed circuit board using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 2461US10836919B2Solvent-free resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Nov 17, 2020·0 cites·14 claims
- 2559US11306239B2High thermal conductivity prepreg and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Apr 19, 2022·0 cites·20 claims
- 2659US2023143461A1Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 2759US2024150532A1Prepreg and uses thereofTAIWAN UNION TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 2858US10059841B2Resin Composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2015·Granted Aug 28, 2018·0 cites·12 claims
- 2957US2025365860A1Copper-clad laminate and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 3055US11414532B2Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted Aug 16, 2022·0 cites·14 claims
- 3155US11015052B2Halogen-free low dielectric resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted May 25, 2021·0 cites·16 claims
- 3255US11001759B2Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted May 11, 2021·0 cites·14 claims
- 3355US2013306357A1Epoxy resin composition, and prepreg and printed circuit board usng the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 3454US2026078287A1Adhesive composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 3553US11667743B2Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2020·Granted Jun 6, 2023·0 cites·14 claims
- 3652US11339258B2Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted May 24, 2022·0 cites·17 claims
- 3752US10793716B2Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2013·Granted Oct 6, 2020·0 cites·10 claims
- 3852US2015189746A1Prepreg and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 3952US2025056720A1Copper clad laminate and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 4051US11840047B2Metal-clad laminate, printed circuit board, and method for manufacturing the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2020·Granted Dec 12, 2023·0 cites·9 claims
- 4151US11312829B2Flexible prepreg and uses thereofTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Apr 26, 2022·0 cites·14 claims
- 4250US10920008B2Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2019·Granted Feb 16, 2021·0 cites·16 claims
- 4350US10246588B1Solvent-free resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2017·Granted Apr 2, 2019·0 cites·20 claims
- 4449US10994516B2Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted May 4, 2021·0 cites·11 claims
- 4549US8383738B2Epoxy resin composition, and prepreg and printed circuit board using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2010·Granted Feb 26, 2013·0 cites·12 claims
- 4648US11643544B2Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2018·Granted May 9, 2023·0 cites·10 claims
- 4746US10081728B2Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2012·Granted Sep 25, 2018·0 cites·6 claims
- 4845US10563006B2Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2017·Granted Feb 18, 2020·0 cites·12 claims
- 4944US10568211B2Resin composition and uses of the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2015·Granted Feb 18, 2020·0 cites·16 claims
- 5034US2018312627A1Resin Composition, Prepreg, Metal-Clad Laminate, and Printed Circuit Board Using the SameTAIWAN UNION TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
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