Epoxy resin blend

Abstract

Embodiments of the present disclosure set forth a prepreg. In one embodiment, the prepreg includes a fibrous material and a resin blend. The resin blend includes an epoxy compound, a compound having a ring structure, and a crosslinking agent. The resin blend has been heated to a temperature substantially greater than 225 degrees Celsius in a curing process when preparing the prepreg.

1 . A prepreg comprising:
 a fibrous material; and   a resin blend comprising an epoxy compound, a compound having a ring structure, and a crosslinking agent, wherein the resin blend has been heated to a temperature substantially greater than 225 degrees Celsius in a curing process when preparing the prepreg.   
     
     
         2 . The prepreg of  claim 1 , wherein the resin blend has been heated to a temperature substantially equal to or substantially greater than 230 degrees Celsius in the curing process. 
     
     
         3 . The prepreg of  claim 1 , wherein the epoxy compound is brominated or phosphonated. 
     
     
         4 . The prepreg of  claim 1 , wherein the ring structure is a carbon ring structure. 
     
     
         5 . The prepreg of  claim 1 , wherein the ring structure is a heterocyclic ring structure. 
     
     
         6 . The prepreg of  claim 5 , wherein the heterocyclic ring structure includes a nitrogen atom. 
     
     
         7 . The prepreg of  claim 1 , wherein the compound having the ring structure is approximately 10 percents to approximately 30 percents by weight of the resin blend. 
     
     
         8 . The prepreg of  claim 7 , wherein the compound having the ring structure is approximately 15 percents to approximately 25 percents by weight of the resin blend. 
     
     
         9 . The prepreg of  claim 1 , wherein the epoxy compound is approximately 30 percents to approximately 50 percents by weight of the resin blend. 
     
     
         10 . The prepreg of  claim 1 , wherein the crosslinking agent is approximately 20 percents to approximately 40 percents by weight of the resin blend. 
     
     
         11 . The prepreg of  claim 1 , wherein the compound having the ring structure is a cyanate ester derived compound. 
     
     
         12 . The prepreg of  claim 1 , wherein the compound having the ring structure is a bismaleimide triazine copolymer. 
     
     
         13 . A laminate comprising:
 a substrate impregnated with a resin blend comprising an epoxy compound, a compound having a ring structure, and a crosslinking agent, wherein the resin blend has been heated to a temperature substantially greater than 225 degrees Celsius in a curing process when preparing a prepreg; and   a layer of metal disposed on a surface of the substrate.   
     
     
         14 . The laminate of  claim 13 , wherein the resin blend has been heated to a temperature substantially equal to or substantially greater than 230 degrees Celsius in the curing process. 
     
     
         15 . The laminate of  claim 13 , wherein the compound having the ring structure is approximately 10 percents to approximately 20 percents by weight of the resin blend. 
     
     
         16 . The laminate of  claim 13 , wherein the compound having the ring structure is a cyanate ester derived compound. 
     
     
         17 . The laminate of  claim 13 , wherein the compound having the ring structure is a bismaleimide triazine copolymer. 
     
     
         18 . A method for preparing a resin blend, comprising:
 mixing an epoxy compound, a compound having a ring structure, and a crosslinking agent to form a mixture; and   heating the mixture to a temperature substantially greater than 225 degrees Celsius in a curing process when preparing a prepreg.   
     
     
         19 . The method of  claim 18 , wherein the compound having the ring structure is a bismaleimide triazine copolymer or a cyanate ester derived compound. 
     
     
         20 . An article of manufacture, comprising:
 a carrier; and   a resin blend comprising an epoxy compound, a compound having a ring structure, and a crosslinking agent, wherein the resin blend has been heated to a temperature substantially greater than 225 degrees Celsius in a curing process when preparing the article of manufacture.