Assignee
TAKADA SYOZO
JP·1 granted patent·1 pending application·0 citations·filing 2005–2012
Top patents by PatentIndex Score
2 records- 0139US8241426B2CMP polishing method, CMP polishing apparatus, and process for producing semiconductor deviceTAKADA SYOZO·Filed 2005·Granted Aug 14, 2012·0 cites·5 claims
- 0239US2012315831A1CMP Polishing Method, CMP Polishing Apparatus, and Process for Producing Semiconductor DeviceTAKADA SYOZO·Filed 2012·Application pending·0 cites
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