Assignee
TAKAGI KAZUTAKA
JP·17 granted patents·3 pending applications·49 citations·filing 2007–2012
Top patents by PatentIndex Score
20 records- 0185US8097906B2Semiconductor device having finger electrodesTAKAGI KAZUTAKA·Filed 2007·Granted Jan 17, 2012·13 cites·5 claims
- 0273US8546852B2Semiconductor deviceTAKAGI KAZUTAKA·Filed 2008·Granted Oct 1, 2013·5 cites·12 claims
- 0373US8471382B2Package and high frequency terminal structure for the sameTAKAGI KAZUTAKA·Filed 2012·Granted Jun 25, 2013·3 cites·12 claims
- 0472US8786369B2High frequency amplifierTAKAGI KAZUTAKA·Filed 2012·Granted Jul 22, 2014·4 cites·7 claims
- 0572US8653896B2Class-AB power amplifierTAKAGI KAZUTAKA·Filed 2011·Granted Feb 18, 2014·3 cites·10 claims
- 0672US8604883B2Class-C power amplifierTAKAGI KAZUTAKA·Filed 2011·Granted Dec 10, 2013·3 cites·10 claims
- 0769US8431973B2High frequency semiconductor deviceTAKAGI KAZUTAKA·Filed 2009·Granted Apr 30, 2013·4 cites·28 claims
- 0866US8912647B2Semiconductor device for smoothing the voltage of the end face of a drain of a high frequency semiconductor chipTAKAGI KAZUTAKA·Filed 2011·Granted Dec 16, 2014·2 cites·9 claims
- 0966US8278685B2Semiconductor device used with high frequency bandTAKAGI KAZUTAKA·Filed 2007·Granted Oct 2, 2012·3 cites·4 claims
- 1066US8106503B2High frequency semiconductor deviceTAKAGI KAZUTAKA·Filed 2010·Granted Jan 31, 2012·2 cites·15 claims
- 1161US9035702B2Microwave semiconductor amplifierTAKAGI KAZUTAKA·Filed 2012·Granted May 19, 2015·1 cites·17 claims
- 1261US8759838B2Package and fabrication method of the sameTAKAGI KAZUTAKA·Filed 2011·Granted Jun 24, 2014·1 cites·13 claims
- 1360US8643438B2Class-AB power amplifierTAKAGI KAZUTAKA·Filed 2011·Granted Feb 4, 2014·2 cites·9 claims
- 1460US8222968B2Microstrip transmission line device including an offset resistive region extending between conductive layers and method of manufactureTAKAGI KAZUTAKA·Filed 2007·Granted Jul 17, 2012·2 cites·5 claims
- 1559US8159311B2High frequency package and manufacturing method thereofTAKAGI KAZUTAKA·Filed 2009·Granted Apr 17, 2012·1 cites·13 claims
- 1650US8476118B2Semiconductor device and fabrication mehtod of the semiconductor deviceTAKAGI KAZUTAKA·Filed 2011·Granted Jul 2, 2013·0 cites·4 claims
- 1749US2013105205A1Joined structural body of members, joining method of members, and package for containing an electronic componentTAKAGI KAZUTAKA·Filed 2012·Application pending·0 cites
- 1842US8637873B2Package and high frequency terminal structure for the sameTAKAGI KAZUTAKA·Filed 2011·Granted Jan 28, 2014·0 cites·13 claims
- 1941US2012199847A1Semiconductor deviceTAKAGI KAZUTAKA·Filed 2012·Application pending·0 cites
- 2040US2012273799A1Semiconductor device and fabrication method for the sameTAKAGI KAZUTAKA·Filed 2011·Application pending·0 cites
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